Investigating Mechanical Properties of Silicon Carbide Coated Carbon Nanotube Composite at Elevated Temperatures

Silicon carbide (SiC) coated vertically aligned carbon nanotubes (VACNT) are attractive material for fabricating MEMS devices as an alternative for bulk micromachining of SiC. In order to examine the mechanical properties of SiC-CNT composites at high temperatures, we fabricated VACNT micro-pillars with different amounts of SiC coating and...

Multi-parameters optimization for electromigration in WLCSP solder bumps

In this study, we combined finite element method (FEM) based on Ansys and Noesis Optimus software to investigate the effect of bump structures and loading conditions on the electromigration properties of solder bumps in WLCSP. A numerical model considering current density, vacancy concentration, stress and temperature was utilized to calculate...

Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films

The trend to 3D and heterogeneous integration enable driving multi-functional blocks in one package. Flip-chip integration is currently playing an important role and is based on solder joints. To overcome the limitations of solder joints, all-copper interconnects have been investigated to meet electrical, thermal, and reliability demands in...

High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material

SnBiAgCu solder alloy is an attractive soldering material for temperature-sensitive electronic devices due to its excellent creep properties. This study firstly reports the creep properties of SnBiAgCu solder alloy under different temperatures. Results show that the addition of Bi resulted in better creep resistance compared with that of...

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

The application of microporous sintered copper (Cu) as a bonding material to replace conventional die-attach materials in power electronic devices has attracted considerable interest. Many previous studies have focused on the effect of processing parameters (temperature, time, pressure) on the microstructure evolution of sintered Cu. However,...

Flexible Collision-free Platooning Method for Unmanned Surface Vehicle with Experimental Validations

This paper addresses the flexible formation problem for unmanned surface vehicles in the presence of obstacles. Building upon the leader-follower formation scheme, a hybrid line-of-sight based flexible platooning method is proposed for follower vehicle to keep tracking the leader ship. A fusion artificial potential field collision avoidance...

A 2m-Range 711uW Body Channel Communication Transceiver Featuring Dynamically-Sampling Bias-Free Interface Front End

Body Channel Communication (BCC) offers a low-loss signal transmission medium for ultra-low-power wearable devices on human body [1]. However, the effective communication range on human body is limited to less than 1m in the state-of-the-art BCC transceivers [2], where the signal loss at the interface of body surface and BCC receiver remains to...

Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects

The objective of this article is to investigate the thermal-fatigue properties of a commercially available lead-free solder alloy (SnBiAgCu) under the use of different types of potting compounds. Solder alloys with lower silver content are expected to substitute the conventional solder alloys SAC305 (Sn-3.0Ag-0.5Cu). First, the tensile...

Multi-level Indoor Path Planning Method

Indoor navigation is increasingly widespread in complex indoor environments, and indoor path planning is the most important part of indoor navigation. Path planning generally refers to finding the most suitable path connecting two locations, while avoiding collision with obstacles. However, it is a fundamental problem, especially for 3D complex...