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Cui, Z. (author), Fan, X. (author), Zhang, Kouchi (author)In this paper, we apply the Eshelby's solution to study the effect of passivation layer on electromigration (EM) failure in a conductor. The passivation layer is considered as an elastic material, not a rigid layer anymore. Thus, the deformation and stress evolution in the conductor during EM are related to the mechanical property of the...conference paper 2023
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Wen, Minzhen (author), Guo, Baotong (author), Chen, Shanghuan (author), Hu, X. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)The (Ca, Sr) AlSiN₃:Eu²⁺(CSASN:Eu) red phosphor is widely used to improve color rendering of high-power phosphor-converted lighting diode (pc-WLED), but it is always unstable under high temperature and high humidity environments. Therefore, the studies on the temperature and humidity resistance of red phosphors and their aging mechanism have...conference paper 2023
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Qian, Cheng (author), Hu, D. (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)Nano-metal materials sintering has received increasing attention in recent years for its promising performance in the wide bandgap semiconductor packaging. In this paper, molecular dynamics (MD) simulation method were applied to simulate the nano-Cu sintering mechanism and the subsequent mechanical behavior. Hybrid sintering, comprising...conference paper 2023
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Tang, Zhuorui (author), Tian, Jing (author), Mao, Chaobin (author), Zhang, Nan (author), Huang, Jiyu (author), Fan, J. (author), Zhang, Kouchi (author)Silicon carbide (SiC) epitaxial process is a key step in the fabrication of power devices, and the temperature field inside the reactor chamber plays an essential role in this process. In this paper, the temperature field in the horizontal chemical-vapor-deposition reactor chamber used for growing homo-epitaxial 4H-SiC material is studied using...conference paper 2023
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Karmakar, S. (author), Zhang, H. (author), Berkhout, Marco (author), Fan, Q. (author)This paper presents a Class-D piezoelectric speaker driver that employs a quadrature feedback chopping scheme (QCS). Compared to a conventional single feedback chopping scheme (SCS), the use of QCS can eliminate the timing skew between low-voltage (LV) and high-voltage (HV) choppers, greatly improving large-signal linearity. A prototype...conference paper 2023
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Hu, D. (author), Li, Z. (author), Fan, J. (author), Zhang, Kouchi (author)As a critical part of speeding up industrial electrification, power electronics, and its packaging technology are undergoing rapid development. Cu nanoparticle sintering technology has therefore received extensive attention for its excellent performance in the die-attachment layer, where the mechanical properties are essential to be known for...conference paper 2023
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Chen, Minggang (author), Zhang, H. (author), Fan, Q. (author)Silicon MOSFETs-based medium-power (< 50W) Class-D amplifiers (CDAs) switching in the MHz range have gained popularity in recent years, which achieves better linearity thanks to a higher loop gain in the audio band while enabling the use of LC filters with higher cut-off frequencies. However, for high-power (>100 W) CDAs, such switching...conference paper 2023
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Cui, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author)This paper investigates thermomigration (TM) and electromigration (EM) in SWEAT structure. Firstly, the distribution of temperature along SWEAT structure during EM is obtained by using finite element (FE) simulation. The FE simulation results show that the temperature is almost uniformly distributed in the most region of narrow line in SWEAT...conference paper 2023
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Shi, Can (author), Fan, Zheng (author), Connolly, David P. (author), Jing, Guoqing (author), Markine, V.L. (author), Guo, Y. (author)Railway ballast performance is dictated by a complex mix of mechanical properties. These effect its performance at the particle level for example in terms of particle degradation, but also at the track system level in terms of settlement and stability. Therefore this paper seeks to develop new understandings of ballast behaviour and identify...review 2023
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Huang, Y. (author), Yu, Suihuai (author), Chu, Jianjie (author), Su, Zhaojing (author), Zhu, Yaokang (author), Wang, Hanyu (author), Wang, Mengcheng (author), Fan, Hao (author)Design knowledge is critical to creating ideas in the conceptual design stage of product development for innovation. Fragmentary design data, massive multidisciplinary knowledge call for the development of a novel knowledge acquisition approach for conceptual product design. This study proposes a Design Knowledge Graph-aided (DKG-aided)...journal article 2023
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Fan, D. (author), Cnossen, J.P. (author), Hung, S. (author), Kromm, D. (author), Dekker, N.H. (author), Verbiest, G.J. (author), Smith, C.S. (author)To better understand the interactions between biological molecules, a high optical resolution in all three dimensions is crucial. The intrinsically lower axial resolution of microscopes however, is a limiting factor in fluorescence imaging, correspondingly in fluorescence based single molecule localization microscopy (SMLM). Here, we present...journal article 2023
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Hu, D. (author), Qian, Cheng (author), Liu, X. (author), Du, L. (author), Sun, Zhongchao (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...journal article 2023
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Wang, Xinyue (author), Yang, Zhoudong (author), Wang, Boya (author), Chen, Wei (author), Zhang, Kouchi (author), Zhang, Jing (author), Fan, J. (author), Liu, P. (author)Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H<sub>2</sub>S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under...journal article 2023
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Jouyaeian, A. (author), Fan, Q. (author), Ausserlechner, Udo (author), Motz, Mario (author), Makinwa, K.A.A. (author)This article presents a hybrid magnetic current sensor for contactless current measurement. Pick-up coils and Hall plates are employed to sense the high and low-frequency fields, respectively, generated by a current-carrying conductor. Due to the differentiating characteristic of the pick-up coils, a flat frequency response can then be...journal article 2023
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Ying, Shen (author), van Oosterom, P.J.M. (author), Fan, Hongchao (author)The recent years observe the vast development in new techniques and methods for modelling, visualization, and analysis of 3D digital cities, as the need of digital twins of urban environment in different applications and simulations has been increased dramatically. This special issue attempts to give an overview of the recent progress and...journal article 2023
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Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS ApplicationHu, D. (author), Shah, M.B. (author), Fan, J. (author), Vollebregt, S. (author), Zhang, Kouchi (author)Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size...journal article 2023
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Huang, Y. (author), Yu, S. Suihuai (author), Chu, J. Jianjie (author), Fan, H. Hao (author), Du, B. Bin (author)Cultural heritage management poses significant challenges for museums due to fragmented data, limited intelligent frameworks, and insufficient applications. In response, a digital cultural heritage management approach based on knowledge graphs and deep learning algorithms is proposed to address the above challenges. A joint entity-relation...journal article 2023
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Fan, Zhi Yuan (author), Qiu, Liu (author), Groeblacher, S. (author), Li, Jie (author)Microwave-optics entanglement is a vital component for building hybrid quantum networks. Here, a new mechanism for preparing stationary entanglement between microwave and optical cavity fields in a cavity optomagnomechanical system is proposed. It consists of a magnon mode in a ferrimagnetic crystal that couples directly to a microwave cavity...journal article 2023
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Zhang, H. (author), Berkhout, M. (author), Makinwa, K.A.A. (author), Fan, Q. (author)This article presents a digital-input class-D amplifier (CDA) achieving high dynamic range (DR) by employing a chopped capacitive feedback network and a capacitive digital-to-analog converter (DAC). Compared with conventional resistive-feedback CDAs driven by resistive or current-steering DACs, the proposed architecture eliminates the noise...journal article 2023
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Zhang, Yi (author), Si, Chundi (author), Fan, Taotao (author), Zhu, Yuefeng (author), Li, Song (author), Ren, S. (author), Lin, P. (author)With the increasing awareness of environmental protection and attention to resource reuse, the development of high-performance and degradable green biomass pavement materials attracts a lot of interest. Lignin and bio-oil effectively combined to play a synergistic role can improve various properties of asphalt and partially replace petroleum...journal article 2023