Sintering Process Simulation of Ag Nanoparticles by Phase Field Method

Low-temperature sintering technology of Ag nanoparticles is widely used in high-power electronic device packaging. Utilizing simulation methods to comprehend and control the microstructure and properties of Ag sintering materials has emerged as a prominent research area. This work uses the General Form PDE module in COMSOL to simplify the...

Warpage deformation analysis of AMB ceramic substrates in power modules

Driven by the increasing demand for high-power systems, ceramic substrates have received more attention for handling higher power density. Warpage in active metal brazed (AMB) ceramic substrate becomes a critical issue as it can deteriorate the reliability performance. This study comprises three phases, including investigation of the cause of...

Weakly-supervised Learning for Fine-grained Emotion Recognition using Physiological Signals

Instead of predicting just one emotion for one activity (e.g., video watching), fine-grained emotion recognition enables more temporally precise recognition. Previous works on fine-grained emotion recognition require segment-by-segment, fine-grained emotion labels to train the recognition algorithm. However, experiments to collect these...

Hysteresis Modeling of Robotic Catheters based on Long Short-Term Memory Network for Improved Environment Reconstruction

Catheters are increasingly being used to tackle problems in the cardiovascular system. However, positioning precision of the catheter tip is negatively affected by hysteresis. To ensure tissue damage due to imprecise positioning is avoided, hysteresis is to be understood and compensated for. This work investigates the feasibility to model...

Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

Interfacial properties of Cu/SiO₂ in semiconductor devices has been a challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO₂. The...