Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation

Liquid crystal polymer (LCP) has gained wide interest in the electronics industry largely due to its flexibility, stable insulation and dielectric properties and chip integration capabilities. Recently, LCP has also been investigated as a biocompatible substrate for the fabrication of multielectrode arrays. Realizing a fully implantable LCP...

Long-term encapsulation of platinum metallization using a HfO2 ALD - PDMS bilayer for non-hermetic active implants

In this work, we investigate the insulating performance of an atomic layer deposited (ALD) HfO2 - polymer bilayer for platinum (Pt) metallization. As test vehicles, Pt interdigitated comb structures (IDC) were designed and fabricated on SiO2/Si substrates. The IDCs were first coated with a 100 nm thin HfO2 ALD layer. A group of samples was...