Simulation and Verification or Cu@Ag Core-shell Sintered Paste for Power Semiconductor Die-attach Applications

With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from...

A numerical Bayesian-calibrated characterization method for multiscale prepreg preforming simulations with tension-shear coupling

Carbon fiber reinforced plastics (CFRPs) are attracting growing attention in industry because of their enhanced properties. Preforming of thermoset carbon fiber prepregs is one of the most common production techniques of CFRPs. To simulate preforming, several computational methods have been developed. Most of these methods, however, obtain...

Interface-Engineered Li₇La₃Zr₂O₁₂-Based Garnet Solid Electrolytes with Suppressed Li-Dendrite Formation and Enhanced Electrochemical Performance

High grain-boundary resistance, Li-dendrite formation, and electrode/Li interfacial resistance are three major issues facing garnet-based solid electrolytes. Herein, interfacial architecture engineering by incorporating 1-butyl-1-methylpyrrolidinium bis(trifluoromethylsulfonyl) imide (BMP-TFSI) ionic liquid into a garnet oxide is proposed....

Deep Eutectic Solvents Enable More Robust Chemoenzymatic Epoxidation Reactions

A chemoenzymatic method for the production of epoxidized vegetable oils was developed. The unique combination of the commercial lipase G from Penicillieum camembertii with certain deep eutectic solvents enabled the efficient production of epoxidized vegetable oils.