Multi-parameters optimization for electromigration in WLCSP solder bumps

In this study, we combined finite element method (FEM) based on Ansys and Noesis Optimus software to investigate the effect of bump structures and loading conditions on the electromigration properties of solder bumps in WLCSP. A numerical model considering current density, vacancy concentration, stress and temperature was utilized to calculate...

Sintering Process Simulation of Ag Nanoparticles by Phase Field Method

Low-temperature sintering technology of Ag nanoparticles is widely used in high-power electronic device packaging. Utilizing simulation methods to comprehend and control the microstructure and properties of Ag sintering materials has emerged as a prominent research area. This work uses the General Form PDE module in COMSOL to simplify the...

Combined effects of stress and temperature on hydrogen diffusion in non-hydride forming alloys applied in gas turbines

Hydrogen plays a vital role in the utilisation of renewable energy, but ingress and diffusion of hydrogen in a gas turbine can induce hydrogen embrittlement on its metallic components. This paper aims to investigate the hydrogen transport in a non-hydride forming alloy such as Alloy 690 used in gas turbines inspired by service conditions of...