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Zhang, Liang (author), Li, Guang (author), Chen, Huang (author), Tang, Jingtian (author), Yang, Guanci (author), Yu, Mingbiao (author), Hu, Yong (author), Xu, Jun (author), Sun, J. (author)Audio magnetotelluric (AMT) is commonly used in mineral resource exploration. However, the weak energy of AMT signals makes them susceptible to being overwhelmed by noise, leading to erroneous geophysical interpretations. In recent years, deep learning has been applied to AMT denoising and has shown better denoising performance compared to...journal article 2024
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Luo, Runding (author), Hu, D. (author), Qian, Cheng (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)Nano-metal materials have received considerable attention because of their promising performance in wide bandgap semiconductor packaging. In this study, molecular dynamics (MD) simulation was performed to simulate the nano-Cu sintering mechanism and the subsequent mechanical behaviors. Hybrid sintering, comprising nanosphere (NS) and...journal article 2024
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Chen, Wei (author), Liu, Xu (author), Hu, D. (author), Liu, X. (author), Zhu, Xi (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)During operation in environments containing hydrogen sulfide (H<sub>2</sub>S), such as in offshore and coastal environments, sintered nanoCu in power electronics is susceptible to degradation caused by corrosion. In this study, experimental and molecular dynamics (MD) simulation analyses were conducted to investigate the evolution and...journal article 2024
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Chen, Wei (author), Liu, Xu (author), Yang, Zhoudong (author), Liu, X. (author), Hu, D. (author), Zhu, Xi (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)The power semiconductor joining technology through sintering of copper nanoparticles is well-suited for die attachment in wide bandgap (WBG) semiconductors, offering high electrical, thermal, and mechanical performances. However, sintered nanocopper will be prone to degradation resulting from corrosion in sulfur-containing corrosive...journal article 2024
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Hu, X. (author), Huang, Jianlin (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Low-temperature sintering technology of Ag nanoparticles is widely used in high-power electronic device packaging. Utilizing simulation methods to comprehend and control the microstructure and properties of Ag sintering materials has emerged as a prominent research area. This work uses the General Form PDE module in COMSOL to simplify the...conference paper 2024
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Liu, Xu (author), Hu, D. (author), Li, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)The nano-copper particles are widely used in the sintering processes of packaging wide bandgap semiconductors. Despite the significant success in the industry, the mechanism bridging the sintering process to the mechanical properties of sintered nano-copper is not yet well-modeled. In this paper, the impacts of different sintering temperatures...conference paper 2024
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Hu, D. (author), Wang, Chieh (author), Li, Z. (author), Gupta, N. (author), Poelma, René H. (author), Shi, Ziliang (author), Fan, J. (author), Zhang, Kouchi (author)Driven by the increasing demand for high-power systems, ceramic substrates have received more attention for handling higher power density. Warpage in active metal brazed (AMB) ceramic substrate becomes a critical issue as it can deteriorate the reliability performance. This study comprises three phases, including investigation of the cause of...conference paper 2024
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Hu, D. (author), Du, L. (author), Alfreider, Markus (author), Fan, J. (author), Kiener, Daniel (author), Zhang, Kouchi (author)To fulfill the high-temperature application requirement of high-power electronics packaging, Cu nanoparticle sintering technology, with benefits in low-temperature processing and high-melting point, has attracted considerable attention as a promising candidate for the die-attach interconnect. Comprehensive mechanical characterization of the...journal article 2024
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Wong, Dominique Hiulong (author), Zhang, Chunbo (author), Di Maio, F. (author), Hu, Mingming (author)Lack of knowledge and tools hampers circular transition in the construction industry. This study analyzes the potential of a framework of circular indicators put forward by the Building Research Establishment Environmental Assessment Method (BREEAM-C) as an answer to the prevailing need of a metric for building circularity assessment to...journal article 2024
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Zhang, Zheng (author), Zhang, Dengyu (author), Zhang, Qingrui (author), Pan, W. (author), Hu, Tianjiang (author)Integrating rule-based policies into reinforcement learning promises to improve data efficiency and generalization in cooperative pursuit problems. However, most implementations do not properly distinguish the influence of neighboring robots in observation embedding or inter-robot interaction rules, leading to information loss and inefficient...journal article 2024
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Zhang, Lujing (author), Hu, Yuchen (author), Li, Peng (author), Wei, Renke (author), Pang, Hongtao (author), de Kreuk, M.K. (author), Qu, Shen (author), Lam, K.L. (author), van der Meer, Walter (author), Liu, G. (author)This study assessed the evolution of wastewater systems during the rapid urbanization of Beijing, with special focuses on the carbon footprints and growing underground WWTPs (u-WWTPs). Specifically, the Bishui plant (in situ constructed u-WWTP) was assessed in detail regarding eco-environmental benefits. Our results showed that, the direct...journal article 2024
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Hu, Yan (author), Liu, Zhengxuan (author), Ai, Zhengtao (author), Zhang, Guoqiang (author)Ventilative cooling is an energy-saving technology to diminish thermal discomfort and overheating risk of buildings, meanwhile achieving high indoor air quality (IAQ). However, there is still no optimal control strategy in practice, which considerably limits its application. This study developed a typical office building model to evaluate the...journal article 2023
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Zhang, Ruihua (author), Xiao, Rong (author), Wang, Feifei (author), Chu, Wenhai (author), Hu, Jinglong (author), Zhang, Yu (author), Jin, Wei (author), van der Hoek, J.P. (author), Xu, Zuxin (author)The illicit connection of sewage pipes to stormwater pipes commonly occurs in urban stormwater systems. This brings problems that sewage might be directly discharges into natural water and even drinking water sources without treatment, posing risks to ecological safety. Sewage contains various unknown dissolved organic matter (DOM), which could...journal article 2023
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Chen, Yuanyuan (author), Dai, Hanqing (author), Yan, Yukun (author), Piao, Zhiyan (author), Lu, Hanxu (author), Hu, Zhe (author), Wei, Wei (author), Zhang, Kouchi (author), Zhang, Wanlu (author), Guo, Ruiqian (author)In recent years, various functional fabrics capable of responding to multistimuli have been widely recognized as promising wearable devices. However, the obtained composite functional fabrics have only been applied in a few scenarios, rendering the achievement of multifunctional wearable application scenarios a difficult goal. Therefore,...journal article 2023
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Wang, Chuan (author), Sun, Renjuan (author), Hu, Xinlei (author), Guan, Yanhua (author), Yang, Yingzi (author), Lu, Wei (author), Tian, Jun (author), Zhang, Hongzhi (author), Ge, Zhi (author), Šavija, B. (author)This paper presents a research on the chloride penetration behavior of engineered cementitious composites (ECC) under sustained flexural loads. Three load levels, i.e. 30 %, 60 % and 75 % of the ultimate flexural load were used. Chloride diffusion depth and concentration profile were measured 30, 60 and 150 days after the specimen was exposed...journal article 2023
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Chen, Yuanyuan (author), Dai, Hanqing (author), Hu, Zhe (author), Wei, Jinxin (author), Zhou, Wenjie (author), Duan, Zhongtao (author), Cui, Zhongjie (author), Wei, Wei (author), Zhang, Kouchi (author)Hydrogel materials have biocompatibility, flexibility, transparency, self-healing ability, adhesion with various substrates, anti-freeze ability, and high-temperature resistance. However, the existing hydrogel devices cannot continue to operate in the case of damage, and they cannot work during the repair period, which brings great challenges...journal article 2023
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Hu, Jie (author), Liu, Zhengxuan (author), Ma, Guochuan (author), Zhang, Guoqiang (author), Ai, Zhengtao (author)Past studies reveal that air infiltration through the building envelope and its impact on the indoor environment and energy consumption are significantly influenced by climate characteristics. However, little relevant information is available for buildings in southern China, where the building design traditionally follows a philosophy of...journal article 2023
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Tukker, Arnold (author), Behrens, Paul (author), Deetman, Sebastiaan (author), Hu, Mingming (author), Migoni Alejandre, E. (author), van der Meide, Marc (author), Zhong, Xiaoyang (author), Zhang, Chunbo (author)In terms of mass, construction materials and construction and demolition waste make up the largest part of humankind's material and waste footprints, particularly after an energy transition has largely phased out fossil energy. However, a circular use of building and construction materials is fraught with challenges.journal article 2023
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Wen, Minzhen (author), Guo, Baotong (author), Chen, Shanghuan (author), Hu, X. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)The (Ca, Sr) AlSiN₃:Eu²⁺(CSASN:Eu) red phosphor is widely used to improve color rendering of high-power phosphor-converted lighting diode (pc-WLED), but it is always unstable under high temperature and high humidity environments. Therefore, the studies on the temperature and humidity resistance of red phosphors and their aging mechanism have...conference paper 2023
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Du, L. (author), Hu, D. (author), Poelm, René (author), van Driel, W.D. (author), Zhang, Kouchi (author)The application of microporous sintered copper (Cu) as a bonding material to replace conventional die-attach materials in power electronic devices has attracted considerable interest. Many previous studies have focused on the effect of processing parameters (temperature, time, pressure) on the microstructure evolution of sintered Cu. However,...conference paper 2023