Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation

The nano-copper particles are widely used in the sintering processes of packaging wide bandgap semiconductors. Despite the significant success in the industry, the mechanism bridging the sintering process to the mechanical properties of sintered nano-copper is not yet well-modeled. In this paper, the impacts of different sintering temperatures...

Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation

Nano-metal materials sintering has received increasing attention in recent years for its promising performance in the wide bandgap semiconductor packaging. In this paper, molecular dynamics (MD) simulation method were applied to simulate the nano-Cu sintering mechanism and the subsequent mechanical behavior. Hybrid sintering, comprising...

Analysis of Thrust-Scaled Acoustic Emissions of Aircraft Propellers and Their Dependence on Propulsive Efficiency

The increasing demand for short-range passenger air transport and the strong push for aircraft with electric propulsion has renewed research interest in propellers. Despite the unmatched aerodynamic efficiency of propellers, their relatively high noise emissions limit widespread application on aircraft. Previous research has not systematically...