Simulation and Verification or Cu@Ag Core-shell Sintered Paste for Power Semiconductor Die-attach Applications

With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from...

Sim4IR: The SIGIR 2021 Workshop on Simulation for Information Retrieval Evaluation

The use of simulation techniques is not foreign to information retrieval. In the past, simulation has been employed, for example, for constructing test collections and for model performance prediction and analysis in a broad array of information access scenarios. Nevertheless, a standardized methodology for performance evaluation via...