Highly-conformal sputtered through-silicon vias with sharp superconducting transition

This paper describes the microfabrication and electrical characterization of aluminum-coated superconducting through-silicon vias (TSVs) with sharp superconducting transition above 1 K. The sharp superconducting transition was achieved by means of fully conformal and void-free DC-sputtering of the TSVs with Al, and is here demonstrated in up...

Superconducting High-Aspect Ratio Through-Silicon Vias with DC-Sputtered Al for Quantum 3D integration

This paper presents the fabrication and electrical characterization of superconducting high-aspect ratio through-silicon vias DC-sputtered with aluminum. Fully conformal and void-free coating of 300 μm-deep and 50 μmwide vias with Al, a CMOS-compatible and widely available superconductor, was made possible by tailoring a funneled sidewall...

A Cryogenic 1 GSa/s, Soft-Core FPGA ADC for Quantum Computing Applications

We propose an analog-to-digital converter (ADC) architecture, implemented in an FPGA, that is fully reconfigurable and easy to calibrate. This approach allows to alter the design, according to the system requirements, with simple modifications in the firmware. Therefore it can be used in a wide range of operating conditions, including a harsh...