Microstructural and micromechanical characterization of sintered nano-copper bump for flip-chip heterogeneous integration

Copper nanoparticles (CuNPs) sintering for flip-chip interconnects is a promising solution for 3D and heterogeneous integration to overcome the limitation of solder materials. To this end, we perform the photolithographic stencil printing method to pattern CuNPs, and the form of flip-chip interconnects is completed after CuNPs sintering...

Nanoindentation characterization of sintered porous Cu nanoparticles used in power electronics packaging – A molecular dynamic simulation study

As a critical part of speeding up industrial electrification, power electronics, and its packaging technology are undergoing rapid development. Cu nanoparticle sintering technology has therefore received extensive attention for its excellent performance in the die-attachment layer, where the mechanical properties are essential to be known for...

High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

Nano-copper sintering is one of new die-attachment and interconnection solutions to realize the wide bandgap semiconductor power electronics packaging with benefits on high temperature, low inductance, low thermal resistance and low cost. Aiming to assess the high-temperature reliability of sintered nano-copper die-attachment and...

Mediation of high temperature radiation damage in bcc iron by Au or Cu precipitation

High temperature radiation damage in binary bcc Fe alloys containing 1 atomic % Au or Cu due to Fe ion irradiation at 550 °C to a peak dose of 2.8 and 8.3 dpa is studied. The precipitation behavior of gold and copper and its correlation to the irradiation-induced defects is studied by transmission electron microscopy and variable energy...

Micromechanical testing and modelling of blast furnace slag cement pastes

This work aims to understand deformation and fracture processes in blast furnace slag cement pastes made using CEM III/B which is commonly used in the Dutch infrastructure sector. First, based on our previous work on Portland cement pastes, a micromechanical model utilizing nanoindentation and X-ray computed tomography (CT) for input is...

Investigation of Pressure Assisted Nanosilver Sintering Process for Application in Power Electronics

High power electronics with wide band gap semiconductors are becoming the most promising devices in new energy power suppliers and converters. Highly reliable die attach materials, serving as one of interconnections, play critical roles in power electronic packages and modules. Among which, the nanosilver paste/film has become a promising die...

Influence of microencapsulated phase change material (PCM) addition on (micro) mechanical properties of cement paste

Excessive cracking can be a serious durability problem for reinforced concrete structures. In recent years, addition of microencapsulated phase change materials (PCMs) to concrete has been proposed as a possible solution to crack formation related to temperature gradients. However, the addition of PCM microcapsules to cementitious materials...