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Ding, Z. (author), Brouwer, J.C. (author), Kwakernaak, C. (author), Zhu, Jia-Ning (author), Popovich, V. (author), Hermans, M.J.M. (author), Sloof, W.G. (author)To prevent premature triggering of the healing reaction in Mo-Si containing self-healing thermal barrier coating system, an oxygen impenetrable shell (α-Al<sub>2</sub>O<sub>3</sub>) around the sacrificial healing particles (MoSi<sub>2</sub>) is desired. Here an encapsulation method is presented through selective oxidation of Al in Mo(Al<sub>x...journal article 2023
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Gao, Hanyan (author), Zhang, Jing (author), Zhu, Yingcan (author), Guo, Ruiqian (author), Zhang, Wanlu (author), Zhang, Kouchi (author), Liu, Pan (author)With the trend of miniaturization and the increasing power density, the operating temperature of electronic devices keeps climbing, especially for wide band-gap semiconductors such as silicon carbide and gallium nitride. The high operating temperature up to 250℃ brings challenges to encapsulation materials since traditional encapsulation...conference paper 2022