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Zhang, Liang (author), Li, Guang (author), Chen, Huang (author), Tang, Jingtian (author), Yang, Guanci (author), Yu, Mingbiao (author), Hu, Yong (author), Xu, Jun (author), Sun, J. (author)Audio magnetotelluric (AMT) is commonly used in mineral resource exploration. However, the weak energy of AMT signals makes them susceptible to being overwhelmed by noise, leading to erroneous geophysical interpretations. In recent years, deep learning has been applied to AMT denoising and has shown better denoising performance compared to...journal article 2024
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Luo, Runding (author), Hu, D. (author), Qian, Cheng (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)Nano-metal materials have received considerable attention because of their promising performance in wide bandgap semiconductor packaging. In this study, molecular dynamics (MD) simulation was performed to simulate the nano-Cu sintering mechanism and the subsequent mechanical behaviors. Hybrid sintering, comprising nanosphere (NS) and...journal article 2024
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Wong, Dominique Hiulong (author), Zhang, Chunbo (author), Di Maio, F. (author), Hu, Mingming (author)Lack of knowledge and tools hampers circular transition in the construction industry. This study analyzes the potential of a framework of circular indicators put forward by the Building Research Establishment Environmental Assessment Method (BREEAM-C) as an answer to the prevailing need of a metric for building circularity assessment to...journal article 2024
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Chen, Wei (author), Liu, Xu (author), Hu, D. (author), Liu, X. (author), Zhu, Xi (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)During operation in environments containing hydrogen sulfide (H<sub>2</sub>S), such as in offshore and coastal environments, sintered nanoCu in power electronics is susceptible to degradation caused by corrosion. In this study, experimental and molecular dynamics (MD) simulation analyses were conducted to investigate the evolution and...journal article 2024
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Hu, D. (author), Du, L. (author), Alfreider, Markus (author), Fan, J. (author), Kiener, Daniel (author), Zhang, Kouchi (author)To fulfill the high-temperature application requirement of high-power electronics packaging, Cu nanoparticle sintering technology, with benefits in low-temperature processing and high-melting point, has attracted considerable attention as a promising candidate for the die-attach interconnect. Comprehensive mechanical characterization of the...journal article 2024
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Chen, Wei (author), Liu, Xu (author), Yang, Zhoudong (author), Liu, X. (author), Hu, D. (author), Zhu, Xi (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)The power semiconductor joining technology through sintering of copper nanoparticles is well-suited for die attachment in wide bandgap (WBG) semiconductors, offering high electrical, thermal, and mechanical performances. However, sintered nanocopper will be prone to degradation resulting from corrosion in sulfur-containing corrosive...journal article 2024
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Hu, D. (author), Wang, Chieh (author), Li, Z. (author), Gupta, N. (author), Poelma, René H. (author), Shi, Ziliang (author), Fan, J. (author), Zhang, Kouchi (author)Driven by the increasing demand for high-power systems, ceramic substrates have received more attention for handling higher power density. Warpage in active metal brazed (AMB) ceramic substrate becomes a critical issue as it can deteriorate the reliability performance. This study comprises three phases, including investigation of the cause of...conference paper 2024
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Hu, X. (author), Huang, Jianlin (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Low-temperature sintering technology of Ag nanoparticles is widely used in high-power electronic device packaging. Utilizing simulation methods to comprehend and control the microstructure and properties of Ag sintering materials has emerged as a prominent research area. This work uses the General Form PDE module in COMSOL to simplify the...conference paper 2024
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Liu, Xu (author), Hu, D. (author), Li, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)The nano-copper particles are widely used in the sintering processes of packaging wide bandgap semiconductors. Despite the significant success in the industry, the mechanism bridging the sintering process to the mechanical properties of sintered nano-copper is not yet well-modeled. In this paper, the impacts of different sintering temperatures...conference paper 2024
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Hu, Yan (author), Liu, Zhengxuan (author), Ai, Zhengtao (author), Zhang, Guoqiang (author)Ventilative cooling is an energy-saving technology to diminish thermal discomfort and overheating risk of buildings, meanwhile achieving high indoor air quality (IAQ). However, there is still no optimal control strategy in practice, which considerably limits its application. This study developed a typical office building model to evaluate the...journal article 2023
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Hu, Zhi Yi (author), Lin, Yi Peng (author), Wang, Qing Ting (author), Zhang, Yi Xin (author), Tang, Jie (author), Wang, Shuai (author), van Loosdrecht, Mark C.M. (author), Zeng, Raymond Jianxiong (author), Zhang, Fang (author)By maintaining the cell integrity of waste activated sludge (WAS), structural extracellular polymeric substances (St-EPS) resist WAS anaerobic fermentation. This study investigates the occurrence of polygalacturonate in WAS St-EPS by combining chemical and metagenomic analyses that identify ∼22% of the bacteria, including Ferruginibacter and...journal article 2023
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Tukker, Arnold (author), Behrens, Paul (author), Deetman, Sebastiaan (author), Hu, Mingming (author), Migoni Alejandre, E. (author), van der Meide, Marc (author), Zhong, Xiaoyang (author), Zhang, Chunbo (author)In terms of mass, construction materials and construction and demolition waste make up the largest part of humankind's material and waste footprints, particularly after an energy transition has largely phased out fossil energy. However, a circular use of building and construction materials is fraught with challenges.journal article 2023
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Zhang, Ruihua (author), Xiao, Rong (author), Wang, Feifei (author), Chu, Wenhai (author), Hu, Jinglong (author), Zhang, Yu (author), Jin, Wei (author), van der Hoek, J.P. (author), Xu, Zuxin (author)The illicit connection of sewage pipes to stormwater pipes commonly occurs in urban stormwater systems. This brings problems that sewage might be directly discharges into natural water and even drinking water sources without treatment, posing risks to ecological safety. Sewage contains various unknown dissolved organic matter (DOM), which could...journal article 2023
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Chen, Yuanyuan (author), Dai, Hanqing (author), Yan, Yukun (author), Piao, Zhiyan (author), Lu, Hanxu (author), Hu, Zhe (author), Wei, Wei (author), Zhang, Kouchi (author), Zhang, Wanlu (author), Guo, Ruiqian (author)In recent years, various functional fabrics capable of responding to multistimuli have been widely recognized as promising wearable devices. However, the obtained composite functional fabrics have only been applied in a few scenarios, rendering the achievement of multifunctional wearable application scenarios a difficult goal. Therefore,...journal article 2023
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Wang, Chuan (author), Sun, Renjuan (author), Hu, Xinlei (author), Guan, Yanhua (author), Yang, Yingzi (author), Lu, Wei (author), Tian, Jun (author), Zhang, Hongzhi (author), Ge, Zhi (author), Šavija, B. (author)This paper presents a research on the chloride penetration behavior of engineered cementitious composites (ECC) under sustained flexural loads. Three load levels, i.e. 30 %, 60 % and 75 % of the ultimate flexural load were used. Chloride diffusion depth and concentration profile were measured 30, 60 and 150 days after the specimen was exposed...journal article 2023
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Sattari, R. (author), Hu, D. (author), Liu, X. (author), van Zeijl, H.W. (author), Vollebregt, S. (author), Zhang, Kouchi (author)The rapid development of power electronics has challenged the thermal integrity of semiconductor packaging. Further developments in this domain can be supported significantly by utilizing fast and flexible thermal characteristic evaluation. This study employs the transient dual interface method (TDIM) to characterize and compare the thermal...journal article 2023
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Hu, D. (author), Qian, Cheng (author), Liu, X. (author), Du, L. (author), Sun, Zhongchao (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...journal article 2023
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Yao, Zhiyu (author), Hu, Weidong (author), Feng, Zhiyan (author), Zhang, Wenlong (author), Liu, Yang (author), Xu, Zhihao (author), Ligthart, L.P. (author)Passive multifrequency microwave sensors frequently struggle with difficulties of nonuniform spatial resolution among multiple channels. The raw measurements in the land-sea transition zone are seriously contaminated. Conventional analytical deconvolution techniques suffer from the tradeoff between spatial resolution enhancement and noise...journal article 2023
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Zhao, Lingqin (author), Zhang, Dongming (author), Hu, Yanjun (author), Guo, Qianqian (author), Jiao, Long (author), Zhou, Nan (author), Di Maio, F. (author)The bottom ash is increasingly used as a substitute aggregate material in road construction in China, and road salting is the major salt source in groundwater. Continuous rainfall releases soluble salts from the bottom ash subgrade into the surrounding soil and groundwater, resulting in potential hazards. Different methods were employed to...journal article 2023
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Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS ApplicationHu, D. (author), Shah, M.B. (author), Fan, J. (author), Vollebregt, S. (author), Zhang, Kouchi (author)Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size...journal article 2023