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Li, Shizhen (author), Liu, X. (author), Gao, Chenshan (author), Wang, S. (author), Li, Jun (author), Ye, Huaiyu (author), Zhang, Kouchi (author), Wu, Shaohui (author)The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...conference paper 2024
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Wang, Zhe (author), Wu, Shilong (author), Chen, Hang (author), He, Mao-Kui (author), Du, Jun (author), Lee, Chin-Hui (author), Chen, Jingdong (author), Watanabe, Shinji (author), Siniscalchi, Sabato Marco (author), Scharenborg, O.E. (author), Liu, Diyuan (author)The Multi-modal Information based Speech Processing (MISP) challenge aims to extend the application of signal processing technology in specific scenarios by promoting the research into wake-up words, speaker diarization, speech recognition, and other technologies. The MISP2022 challenge has two tracks: 1) audio-visual speaker diarization (AVSD),...conference paper 2023
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Wang, L. (author), Qin, Z. (author), Wu, Y. (author), Bauer, P. (author)Reinforcement of the legacy grid infrastructure will be very costly and thereby unrealistic. Consequently, weak grid connection of electric vehicle (EV) chargers will sooner or later be the case. It may however bring instability issues since the EV chargers that can work well in strong grid conditions usually do not fit the weak grid...conference paper 2023
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