High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

Nano-copper sintering is one of new die-attachment and interconnection solutions to realize the wide bandgap semiconductor power electronics packaging with benefits on high temperature, low inductance, low thermal resistance and low cost. Aiming to assess the high-temperature reliability of sintered nano-copper die-attachment and...

Inference algorithms for the useful life of safety instrumented systems under small failure sample data

Safety instrumented systems(SIS) have been widely used in petroleum and chemical plants to detect and respond to dangerous events and prevent them from developing into accidents. The in-service time of SIS does not exceed its useful life is one of the crucial assumptions of IEC functional safety standards. The testing method recommended in the...