Warpage deformation analysis of AMB ceramic substrates in power modules

Driven by the increasing demand for high-power systems, ceramic substrates have received more attention for handling higher power density. Warpage in active metal brazed (AMB) ceramic substrate becomes a critical issue as it can deteriorate the reliability performance. This study comprises three phases, including investigation of the cause of...

Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

Estimation of Facial Contact Pressure Based on Finite Element Analysis

A 3D head and face scan data can be usefully applied in the ergonomic design of a wearable product such as an oxygen mask or a virtual reality (VR) headset to support the safety as well as comfort for a certain amount of a target population. This study is aimed to develop analysis and design methods of an ergonomic facial wearable products (e.g....

Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

Interfacial properties of Cu/SiO2 in semiconductor devices has continued to be the subject of challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. In...

Development of an andvanced fe-numerical method for virtual grading of timber

Structural heterogeneities in wood are changing the complexity of the numerical modelling of this material. Knots are the main strength governing parameters, which are changing the uniformity of the stress distributions through the boards. These weak locations may result in failure in the material. Comprehensive reconstruction of the boards,...

Thermal Expansion and Aging Effects in Neuromorphic Signal Processor

In this paper, we propose an efficient methodology based on a real-time estimator and predictor-corrector scheme for accurate thermal expansion profile and aging evaluation of a neuromorphic signal processor circuit components. As the experimental results indicate, for comparable mesh size, the proposed method is 1~2 order of magnitude more...

Short Circuits of a 10 MW High Temperature Superconducting Wind Turbine Generator

Direct drive high temperature superconducting (HTS) wind turbine generators have been proposed to tackle challenges for ever increasing wind turbine ratings. Due to smaller reactances in HTS generators, higher fault currents and larger transient torques could occur if sudden short circuits happen at generator terminals. In this paper, a finite...