Low-Cost and Low-Temperature Integration Methods for System-in-Package

Packaging has evoluted for years with the sole purpose of protecting the electronics from the environment and providing a suitable operating environment. Integration became a necessity and technologies as System-in-Package emerged and enabled the integration of components built with different technologies within a single package. All this...

Periodical nanocavities in thin films for optical bio-molecular detection

Integrated particle shape sensor

Integrated resonant magnetic field sensor