Multi-Scale Material and Technology for Heterogeneous Integration

This thesis describes a series of experiments and fabrication methods on high-aspect-ratio 3D microstructures for wafer level packaging and 3D heterogeneous system integration (3D-HSI) using novel materials such as carbon nanotubes and thick-film photo-resists. Furthermore, theoretical and experimental research efforts are made to understand the...

Organic Materials Degradation in Solid State Lighting Applications

In this thesis the degradation and failure mechanisms of organic materials in the optical part of LED-based products are studied. The main causes of discoloration of substrate/lens in remote phosphor of LED-based products are also comprehensively investigated. Solid State Lighting (SSL) technology is a new technology based on light emitting...

Fast Qualification of Solder Reliability in Solid-state Lighting System

Solid-state lighting (SSL), which is based 0n semiconductor Lighting Emitting Diode (LED), is the most promising and reliable energy saving solution for future lighting applications. Since a bare LED die can hardly survive without a package, one of the most import function of the LED package is to facilitate the electrical connection and heat...

A Systematic Approach to Address the Reliability of Solid State Lighting Drivers

Solid State Lighting (SSL) technology is a new technology based on light emitting diodes as light sources. This technology due to its several outstanding characteristics such as lower energy consumption, longer lifetime, and higher design flexibility with respect to the conventional lighting technology has become very attractive to both...

Thermal management of solid state lighting module

Solid-State Lighting (SSL), powered by Light-Emitting Diodes (LEDs), is an energy-efficient technology for lighting systems. In contrast to incandescent lights which obtain high efficiency at high temperatures, the highest efficiency of LEDs is reached at low temperatures. The thermal management in LED product is then a key design parameter as...

Molecular modeling in design of polyaniline for polymer-based carbon dioxide sensor

Conducting polymers are attractive chemical sensing materials due to their outstanding characteristics including low cost, room-temperature operations, easy device fabrication, high sensitivity and short response time. The new nanowires architecture, with high surface-to-volume ratio, makes possible the conducting polymers an ultra fast...

Design for Reliability of Wafer Level MEMS packaging

The world has seen an unrivaled spread of semiconductor technology into virtually any part of society. The main enablers of this semiconductor rush are the decreasing feature size and the constantly decreasing costs of semiconductors. The decreasing costs of semiconductors in general are caused by the smaller feature size, the higher yield and...

Fast Qualification Methods for Microelectronic Packages

This research aims at developing a knowledge based fast qualification method for moisture or thermally induced failure in microelectronic packages. Driven by the market competition and the need for shorter time to market, fast qualification tests are becoming more and more important for the industry. Qualifications are tests which are used in...

Theory of electrochemical cells and its application to plastic-encapsulated IC reliability

Cure-Dependent Viscoelastic Behaviour of Electronic Packaging Polymers: Modelling, Characterization, Implementation and Applications

Polymers are widely used in electronic packaging as encapsulants, underfills, adhesives, insulators, and dielectrics, etc. Generally these materials are thermosetting polymers that have to be cured during the fabrication process at elevated temperatures. The curing process will introduce residual stress and warpage in the microelectronic devices...

Virtual thermo-mechanical prototyping of microelectronics devices

Microelectronics have pervaded our lives for the past fifty years, with massive penetration into health, mobility, safety and security, communications, education, entertainment and virtually every aspect of human lives. The main technology drivers that enabled this expansion are miniaturization and integration. The combination of these two has...