Low Temperature Fine Pitch All-Copper Interconnects Combining Photopatternable Underfill Films

The trend to 3D and heterogeneous integration enable driving multi-functional blocks in one package. Flip-chip integration is currently playing an important role and is based on solder joints. To overcome the limitations of solder joints, all-copper interconnects have been investigated to meet electrical, thermal, and reliability demands in...

Self-similarity matrix based slow-time feature extraction for human target in high-resolution radar

A new approach is proposed to extract the slow-time feature of human motion in high-resolution radars. The approach is based on the self-similarity matrix (SSM) of the radar signals. The Mutual Information is used as a measure of similarity. The SSMs of different radar signals (high-resolution range profile, micro-Doppler, and range-Doppler...

Wideband High Power Doherty Amplifiers

Currently the Doherty Power Amplifier (DPA) is replacing the traditional Class B amplifier in base-station and broadcast applications, as such becoming the preferred choice of industry due to its simplicity and high efficiency performance. In spite of its success, so far practical DPA implementations can provide only a very limited RF bandwidth,...

Single-grain Si TFTs for high-speed flexible electronics

Existent flat-panel display is mechanically stiff because it requires external connection of IC chips. At its present stage, displays with a-Si, metal oxide semiconductor or organic TFTs require still external connection of data driver and controllers, because of their low carrier mobilities. We will review our recent progress on direct...

Preferred <100> Surface and In-Plane Orientations in Self-Assembled Poly-Si by Multiple Excimer Laser Irradiation