Searched for: mods_originInfo_publisher_s%3A%22IEEE%22
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document
Ji, X. (author), van Ginkel, H.J. (author), Hu, D. (author), Schmidt-Ott, A. (author), van Zeijl, H.W. (author), Vollebregt, S. (author), Zhang, Kouchi (author)
Advances in semiconductor device manufacturing technologies are enabled by the development and application of novel materials. Especially one class of materials, nanoporous films, became building blocks for a broad range of applications, such as gas sensors and interconnects. Therefore, a versatile fabrication technology is needed to...
conference paper 2022
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Romijn, J. (author), Vollebregt, S. (author), May, Alexander (author), Erlbacher, Tobias (author), van Zeijl, H.W. (author), Leijtens, J.A.P. (author), Zhang, Kouchi (author), Sarro, Pasqualina M (author)
In this paper, we present a quadrant sun position sensor microsystem device in a silicon carbide technology that operates in a field-of-view of ±33° and reaches a mean error of 1.9° in this range. This will allow, for the first time, an inherently visible blind sun position sensor in a CMOS compatible technology. Opto-electronic integration of...
conference paper 2022
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Romijn, J. (author), Middelburg, L.M. (author), Vollebregt, S. (author), el Mansouri, B. (author), van Zeijl, H.W. (author), May, Alexander (author), Erlbacher, Tobias (author), Zhang, Kouchi (author), Sarro, Pasqualina M (author)
Accurately sensing the temperature in silicon carbide (power) devices is of great importance to their reliable operation. Here, temperature sensors by resistive and CMOS structures are fabricated and characterized in an open silicon carbide CMOS technology. Over a range of 25-200°C, doped design layers have negative temperature coefficients of...
conference paper 2021
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Romijn, J. (author), Vollebregt, S. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author), Leijtens, Johan (author), Sarro, Pasqualina M (author)
In this paper we present a sun position sensor platform with a scalable approach for the 3D integration of the sensor optics. This would facilitate the sun position sensor miniaturization, reduces fabrication cost and mitigates the need for sensor calibration. The sun position sensor platform is implemented in a seven mask BICMOS technology with...
conference paper 2021
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Romijn, J. (author), Vollebregt, S. (author), van Zeijl, H.W. (author), Sarro, Pasqualina M (author)
In this paper we present, for the first time, the successful monolithic wafer-scale integration of CVD graphene with CMOS logic for highly miniaturized smart sensing structures with on-chip readout electronics. The use of a patterned CMOS compatible catalyst for pre-defined regions of CVD graphene growth, and the transfer-free process used,...
conference paper 2019
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Vollebregt, S. (author), Alfano, B. (author), Ricciardella, F. (author), Giesbers, A.J.M. (author), Hagendoorn, Y. (author), van Zeijl, H.W. (author), Polichetti, T (author), Sarro, Pasqualina M (author)
In this paper we report a novel transfer-free graphene fabrication process, which does not damage the graphene layer. Uniform graphene layers on 4" silicon wafers were deposited by chemical vapor deposition using the CMOS compatible Mo catalyst. Removal of the Mo layer after graphene deposition results in a transfer-free and controlled placement...
conference paper 2016
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