Searched for: subject%253A%2522MEMS%2522
(1 - 5 of 5)
document
Campos de Oliveira, A. (author), Pan, Sining (author), Wiegerink, Remco J. (author), Makinwa, K.A.A. (author)
This article presents a microelectromechanical system (MEMS) Coriolis-based mass-flow-to-digital converter (Φ DC) that can be used with both liquids and gases. It consists of a micromachined Coriolis mass flow sensor and a CMOS interface circuit that drives it into oscillation and digitizes the resulting mass flow information. A phase-locked...
journal article 2022
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Oliveira Alves, A.C. (author), Schut, T. V.P. (author), Groenesteijn, J. (author), Fan, Q. (author), Wiegerink, R. J. (author), Makinwa, K.A.A. (author)
This paper describes an interface circuit for a MEMS Coriolis mass flow sensor that combines both drive and sense circuitry. The MEMS sensor consists of a suspended resonant tube, which is read-out by comb capacitors and driven into oscillation by current flowing through a drive coil in a magnet field. The interface circuit comprises a low...
conference paper 2019
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Zaliasl, S (author), Salvia, JC (author), Hill, GC (author), Chen, L (author), Joo, K (author), Palwai, R (author), Arumugam, N (author), Phadke, M (author), Mukherjee, S (author), Lee, HC (author), Grosjean, C (author), Hagelin, PM (author), Pamarti, S (author), Fiez, TS (author), Makinwa, K.A.A. (author), Partridge, A (author), Menon, V (author)
This
journal article 2015
document
Rajaraman, V. (author), Hau, B.S. (author), Rocha, L.A. (author), French, P.J. (author), Makinwa, K.A.A. (author)
This work reports on the design and modeling of a new flexible contact-mode 1-DOF piezoresistive contact force and impacttime detector used for acceleration sensing in the time domain. The key advantages of the contact-mode detection mechanism are the use of simple readout circuitry, compactness, good linearity, scalability, and the potential to...
journal article 2010
document
Rajaraman, V. (author), Makinwa, K.A.A. (author), French, P.J. (author)
We present a simple, flexible and low cost MEMS fabrication process, developed using deep reactive ion etching (DRIE) and wafer bonding technologies, for manufacturing in-plane high aspect ratio (HAR) inertial sensors. Among examples, the design and fabrication results of a two axis inertial device are presented. Fabricated device thickness...
conference paper 2008
Searched for: subject%253A%2522MEMS%2522
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