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Ahmad, T. (author), Al-Ars, Z. (author), Hofstee, H.P. (author)Background Recently many new deep learning–based variant-calling methods like DeepVariant have emerged as more accurate compared with conventional variant-calling algorithms such as GATK HaplotypeCaller, Sterlka2, and Freebayes albeit at higher computational costs. Therefore, there is a need for more scalable and higher performance workflows of...review 2021
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Savov, A.M. (author), Joshi, S. (author), Shafqat, Salman (author), Hoefnagels, Johan (author), Louwerse, M.C. (author), Stoute, R. (author), Dekker, R. (author)A device for studying the mechanical and electrical behavior of free-standing micro-fabricated metal structures, subjected to a very large deformation, is presented in this paper. The free-standing structures are intended to serve as interconnects in high-density, highly stretchable electronic circuits. For an easy, damage-free handling and...journal article 2018
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Wu, K. (author), Tichem, M. (author)Photonic packaging, which includes high-precision assembly of photonic sub-systems, is currently a bottleneck in the development of commercially-available integrated photonic products. In the pursuit of a fully-automated, high-precision, and cost-effective photonic alignment scheme for two multi-channel photonic chips, this paper explores...journal article 2018
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Peters, T.J. (author), Tichem, M. (author)This paper proposes a microfabrication process for the reliable release of SiO2 beam structures. These structures are intended to be utilized in SiO2 photonic MEMS. A major fabrication challenge is the release of thick (>10 ?m) SiO2 structures with high yield. A single mask process is developed based on temporary reinforcement of the SiO2...journal article 2015