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Hu, D. (author), Qian, Cheng (author), Liu, X. (author), Du, L. (author), Sun, Zhongchao (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...journal article 2023
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Sun, B. (author), Fan, J. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Zhang, Guohao (author)In this paper, a physics of failure-based prediction method is combined with statistical models to consider the impact of current crowding and current droop effects on the reliability of LED arrays. Electronic-thermal models of LEDs are utilized to obtain the operation conditions under the influences of current crowding and current droop. A...journal article 2019
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Zhan, X. (author), Liu, Chuang (author), Sun, Gui-Quan (author), Zhang, Zi-Ke (author)Research on the interplay between the dynamics on the network and the dynamics of the network has attracted much attention in recent years. In this work, we propose an information-driven adaptive model, where disease and disease information can evolve simultaneously. For the information-driven adaptive process, susceptible (infected)...journal article 2018
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Liang, K. (author), Zhang, Y. (author), Sun, Q. (author), Ruess, M. (author)A knock-down factor is commonly used to take into account the obvious decline of the buckling load in a cylindrical shell caused by the inevitable imperfections. In 1968, NASA guideline SP-8007 gave knock-down factors which rely on a lower-bound curve taken from experimental data. Recent research has indicated that the NASA knock-down factors...journal article 2015