Optimization of a plasma etching machine for failure analysis of semiconductors

Microwave Induced Plasma (MIP) is an advanced decapsulation tool developed by Jiaco Instruments. The goal of this thesis is to optimise the current MIP system. There are two directions: 1. Improve the etching rate. 2. Find selectivity between different materials (Si, SiO2, SiN). The experiments are divided into two parts in total, improved...

MIP Plasma Decapsulation of Copper-wired Semiconductor Devices for Failure Analysis

The majority of Integrated Circuit (IC) devices are encapsulated in wire-bonded plastic IC packages. Epoxy molding compound is used as the encapsulation material and gold was used as the bonding wire material. However, the increase of gold material price from 400 USD/ounce in year 2005 to 1400 USD/ounce in year 2013 results in a major cost issue...

Deep anisotropic dry etching of silicon microstructures by high-density plasmas

This thesis deals with the dry etching of deep anisotropic microstructures in monocrystalline silicon by high-density plasmas. High aspect ratio trenches are necessary in the fabrication of sensitive inertial devices such as accellerometers and gyroscopes. The etching of silicon in fluorine-based plasmas is isotropic. To obtain anisotropy the...

Plasma Etching for Integrated Silicon Sensor Applications