Warpage analysis on power module ceramic substrates

This study deals with the challenge of warpage in power modules, vital components in the rapidly expanding electric and hybrid-electric vehicle industry. The variations in temperature during manufacturing, resulting in significant warpage changes, contribute to device cracks, delamination, and reduced reliability.<br/>The primary focus is...

A Thin-film Reconfigurable SiC Thermal Test Chip for Reliability Monitoring in Harsh Environments

Wide bandgap (WBG) semiconductor technologies enable significant progress in the emergence of power modules. Power cycling at elevated temperatures causes crack or delamination failure, especially at the die-attached bonded interface in the long term. Therefore, the in-situ reliability investigation of power modules, materials, and...

Effect of epoxy resin addition on properties and corrosion behavior of sintered joints in power modules serviced offshore

Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H₂S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under...

Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules

Double-sided packages for heat dissipation are an efficient thermal management mechanism for power semiconductor devices. A fan-out panel-level packaging (FOPLP), as one of the double-sided forms, exhibits excellent electro–thermal characteristics and provides low stray inductance and thermal resistance. Besides, the temperature at each point...

Finite Element Analysis of Power Module Packages with One-step Molding for Power Inductors

With the development of 5G communication technology and the rise of power semiconductors, the switching frequency of the circuit keeps increasing, which pushes for miniaturization of power modules and related components. Therefore, in this paper, a one-step molding technology was proposed for a DC/DC buck converter power module. We proposed a...

Fan-Out SiC MOSFET Power Module in an Organic Substrate

Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

In this article, a novel fan-out panel-level printed circuit board (PCB)-embedded package for phase-leg silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) power module is presented. Electro-thermo-mechanical co-design was conducted, and the maximum package parasitic inductance was found to be about 1.24 nH at 100...

Review of Packaging Schemes for Power Module

SiC devices are promising for outperforming Si counterparts in high-frequency applications due to its superior material properties. Conventional wirebonded packaging scheme has been one of the most preferred package structures for power modules. However, the technique limits the performance of a SiC power module due to parasitic inductance...

ENMOS: Energy Module for Self-Sustainable Wearable Sensors

This work focuses on addressing the fundamental limitation on the minimum cold start-up voltage that could be harvested from a thermoelectric element (TEG) for human-body wearable applications. For ultra-low DC voltages, the challenge translates to generating a timed-signal to amplify it up to a value that could be used to drive, say, a boost...

Power Modulation based Device-Socket Association

Smart metering can be entitled as a pivotal research area empowering the provision of enhanced energy conservation services. Academic research focuses mainly on upper context aspects such as smart grids or smart homes. Relatively lower interest is drawn to user awareness for reducing energy usage. Every individual can achieve a greener footprint...

The electrical, thermal and spatial integration of a converter in a power electronic module

This thesis is concerned with the design and implementation of a power electronic system (14/42V DC/DC converter) that is implemented in the automotive environment, specifically the engine compartment. The power electronic system must have a high power density while operating in a high temperature environment. Power electronic modules are...