A Compressed Sensing Algorithm for Magnetic Dipole Localization

This paper proposes an algorithm to localize a magnetic dipole using a limited number of noisy measurements from magnetic field sensors. The algorithm is based on the theory of compressed sensing, and exploits the sparseness of the magnetic dipole in space. Beforehand, a basis consisting of magnetic dipole fields belonging to individual...

A Stereovision-based Navigation System for Autonomous Vessels

Sustainability goals have reignited interest in more fuel efficient modalities for urban freight transportation. The autonomous inland vessel has the potential to enable a modality shift to the waterway, however economically-conscious solutions to the technological challenges are lacking. This paper explores the potential role of stereovision...

A rugged FBG-based pressure sensor for water level monitoring in dikes

This paper describes the implementation of an FBG sensor to measure water levels in a dike. The sensor is based on a 3D-printed mechanical transducer through which the external pressure is converted into longitudinal strain exerted on the fiber. An additional FBG integrated within the sensor measures temperature and is used to compensate for...

A semi-physical platform for guidance and formations of fixed-wing unmanned aerial vehicles

Unmanned Aerial Vehicles (UAVs) have multi-domain applications, fixed-wing UAVs being a widely used class. Despite the ongoing research on the topics of guidance and formation control of fixed-wing UAVs, little progress is known on implementation of semi-physical validation platforms (software-in-the-loop or hardware-in-the-loop) for such...

System in package (SiP) technology: Fundamentals, design and applications

Purpose: The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP) approach. This new packaging approach is based on stacked silicon submount technology. As demonstrators, a smart lighting module and a sensor systems were successfully developed by using the fabrication and assembly process described in this paper. Design...