Increased backing softness of planar smooth dry adhesives enhances contact area and frictional load capacity on a cylindrical substrate: With bio-inspired backings: Solid, Sponge & Inflatable

Dry adhesives can reattach to surfaces due to the reversible bond made by Van der Waals forces. These adhesives can therefore be used as gripping surface that has a high frictional load capacity, independent of the grasping force. In many grippers, the adhesive surface is often pressed into contact with another surface (’substrate’) in an open...

Highly-conformal sputtered through-silicon vias with sharp superconducting transition

This paper describes the microfabrication and electrical characterization of aluminum-coated superconducting through-silicon vias (TSVs) with sharp superconducting transition above 1 K. The sharp superconducting transition was achieved by means of fully conformal and void-free DC-sputtering of the TSVs with Al, and is here demonstrated in up...

A novel method to transfer porous PDMS membranes for high throughput Organ-on-Chip and Lab-on-Chip assembly

We present a novel method to easily and reliably transfer highly porous, large area, thin microfabricated Polydimethylsiloxane (PDMS) porous membranes on Lab-on-Chip (LOC) and Organ-on-Chip (OOC) devices. The use of silicon as carrier substrate and a water-soluble sacrificial layer allows a simple and reproducible transfer of the membranes to...

A transfer-free wafer-scale CVD graphene fabrication process for MEMS/NEMS sensors

In this paper we report a novel transfer-free graphene fabrication process, which does not damage the graphene layer. Uniform graphene layers on 4" silicon wafers were deposited by chemical vapor deposition using the CMOS compatible Mo catalyst. Removal of the Mo layer after graphene deposition results in a transfer-free and controlled placement...