Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules

Double-sided packages for heat dissipation are an efficient thermal management mechanism for power semiconductor devices. A fan-out panel-level packaging (FOPLP), as one of the double-sided forms, exhibits excellent electro–thermal characteristics and provides low stray inductance and thermal resistance. Besides, the temperature at each point...

Boron doping induced thermal conductivity enhancement of water-based 3C-Si(B)C nanofluids

In this paper, the fabrication and thermal conductivity (TC) of water-based nanofluids using boron (B)-doped SiC as dispersions are reported. Doping B into the <i>β</i>-SiC phase leads to the shrinkage of the SiC lattice due to the substitution of Si atoms (0.134 nm radius) by smaller B atoms (0.095 nm radius). The presence of B in the SiC...