A high-performance interface for grounded conductivity sensors

Boron doping induced thermal conductivity enhancement of water-based 3C-Si(B)C nanofluids

In this paper, the fabrication and thermal conductivity (TC) of water-based nanofluids using boron (B)-doped SiC as dispersions are reported. Doping B into the <i>β</i>-SiC phase leads to the shrinkage of the SiC lattice due to the substitution of Si atoms (0.134 nm radius) by smaller B atoms (0.095 nm radius). The presence of B in the SiC...

Charge Carrier Dynamics in Co-evaporated MAPbI₃with a Gradient in Composition

Co-evaporation of metal halide perovskites by thermal evaporation is an attractive method since it does not require harmful solvents and enables precise control of the film thickness. Furthermore, the ability to manipulate the Fermi level allows the formation of a graded homojunction, providing interesting opportunities to improve the charge...

Influence of solder condition on effective thermal conductivity of two-directional random fibres: Pore-scale simulation

It is indicated that the solder joint of the metal fibrous materials is a critical factor impacting the heat conduction. To reveal the mechanism by which solder joint sizes, solder joint skips, solder flux materials, and filling media affect the thermal conductivity of fibres, pore-scale numerical simulation is employed to study the thermal...

Modeling rock damage during the long-term production process for hot dry rocks: Effects of additional conductivity on the production performance and economic efficiency

Hot dry rocks (HDRs), as an essential renewable energy source, its development has received widespread attention, especially for heat extraction. The fracture is the main seepage and heat transfer channel of circulating fluid in dense HDR reservoirs, and its conductivity evolution significantly affects the production performance. Most...

Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules

Double-sided packages for heat dissipation are an efficient thermal management mechanism for power semiconductor devices. A fan-out panel-level packaging (FOPLP), as one of the double-sided forms, exhibits excellent electro–thermal characteristics and provides low stray inductance and thermal resistance. Besides, the temperature at each point...

Experimental characterization of damage during geothermal production of hot dry rocks: Comprehensive effects of the damage-elastic deformation on conductivity evolution

The development of hot dry rocks (HDRs) is of great significance to adjusting energy structure, alleviating energy shortage, reducing pollution, etc. Low-permeability granite is the predominant rock type in deep HDRs, making fractures the primary pathways for fluid circulation and heat extraction. The production of HDRs is significantly...