Suspended Submicron Silicon-Beam for High Sensitivity Piezoresistive Sensing

This paper presents a submicron suspended piezoresistive silicon-beam structure as a basic sensing element to replace the conventional piezoresistors, so to improve the detection sensitivity. The alternative element benefits from the increase of the induced stress, which is locally concentrated on the suspended submicron beam. This approach...

Silicon MEMS for Detection of Liquid and Solid Fronts

High-precision manipulation of small-size objects is an attractive and challenging topic for both industrial production and fundamental scientific research. The capability of monitoring micro-samples during handling is essential to the accuracy and efficiency of a handling system for both liquid and solid samples. When handling liquid samples...

DRIE and Bonding Assisted Low Cost MEMS Processing of In-plane HAR Inertial Sensors

We present a simple, flexible and low cost MEMS fabrication process, developed using deep reactive ion etching (DRIE) and wafer bonding technologies, for manufacturing in-plane high aspect ratio (HAR) inertial sensors. Among examples, the design and fabrication results of a two axis inertial device are presented. Fabricated device thickness...