High Step Coverage Interconnects By Printed Nanoparticles

The growing diversity in the used materials in semiconductor packaging provides challenges for achieving good interconnection. Particularly the very soft substrates, such as paper and polymers, and very hard, such as silicon carbide, offer unique challenges to wire-bonding or formation of vertical interconnects. Complementary technologies are...

The direct growth of carbon nanotubes as vertical interconnects in 3D integrated circuits

Carbon nanotubes (CNT) have been proposed for many applications in integrated circuits (IC): ranging from transistors and interconnects to sensors and actuators. For these applications it is crucial to integrate CNT directly alongside electronics, something which has not been achieved before. In this work we demonstrate the direct growth of CNT...

Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings

The porous nature of carbon nanotube (CNT) arrays allows for the unique opportunity to tailor their mechanical response by the infiltration and deposition of nanoscale conformal coatings. Here, we fabricate novel photo-lithographically defined CNT pillars that are conformally coated with amorphous silicon carbide (a-SiC) to strengthen the...

Carbon Nanotubes as Vertical Interconnects in 3D Integrated Circuits

Interconnects in integrated circuits (IC) are the major cause of power dissipation and delay. 3D integration has been proposed as a method to reduce these issues. For this 3D integration, fabrication of high aspect ratio reliable vertical interconnects (vias) are required. For this new materials, like carbon nanotubes (CNT), are being considered...