Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling

During the operation of an LED array, its thermal and optical performances are always not equal to the superposition of the individual LED's characteristics because of a significant thermal coupling effect between the arrays. Based on this, this paper proposes an electrical–photo-thermal model, with considering both junction temperature and...

Luminous performances characterization of YAG: Ce3+ phosphor/silicone composites using both reflective and transmissive laser excitations

YAG: Ce3+ phosphor/silicone composites are widely used in solid-state lighting as a light converter to achieve white lighting. However, because of high thermal resistance and low thermal stability, the luminous performance of YAG: Ce3+ phosphor/silicone composite deteriorates rapidly when excited by high-power-density blue-laser. To explore...

Super Tough and Spontaneous Water-Assisted Autonomous Self-Healing Elastomer for Underwater Wearable Electronics

Self-healing soft electronic material composition is crucial to sustain the device long-term durability. The fabrication of self-healing soft electronics exposed to high moisture environment is a significant challenge that has yet to be fully achieved. This paper presents the novel concept of a water-assisted room-temperature autonomous self...

Reliability Assessment of Light-Emitting Diode Packages with Both Luminous Flux Response Surface Model and Spectral Power Distribution Method

The inherent luminous characteristics and stability of LED packages during the operation period are highly dependent on their junction temperatures and driving currents. In this paper, the luminous flux of LED packages operated under a wide range of driving currents and junction temperatures are investigated to develop a luminous flux...

Color Shift Modeling of Light-Emitting Diode Lamps in Step-Loaded Stress Testing

The color coordinate shift of light-emitting diode (LED) lamps is investigated by running three stress-loaded testing methods, namely step-up stress accelerated degradation testing, step-down stress accelerated degradation testing, and constant stress accelerated degradation testing. A power model is proposed as the statistical model of the...

Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component

The objective of this study is to quantitatively evaluate the impacts of LED components on the overdriving reliability of high power white LED chip scale packages (CSPs). The reliability tests under room temperature are conducted over 1000 h in this study on CSP LEDs with overdriving currents. A novel method is proposed to investigate the...