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van der Walle, P (author), Kramer, E. (author), van der Donck, J.C.J. (author), Mulckhuyse, W (author), Nijsten, L. (author), Bernal Arango, F.A. (author), de Jong, A. (author), van Zeijl, E. (author), Spruit, H. E.T. (author), van den Berg, J.H. (author), Nanda, G. (author), van Langen-Suurling, A.K. (author), Alkemade, P.F.A. (author), Pereira, S.F. (author), Maas, D.J. (author)Particle defects are important contributors to yield loss in semi-conductor manufacturing. Particles need to be detected and characterized in order to determine and eliminate their root cause. We have conceived a process flow for advanced defect classification (ADC) that distinguishes three consecutive steps; detection, review and...conference paper 2017
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Bouwens, MAJ (author), Maas, D (author), van der Donck, JCJ (author), Alkemade, P.F.A. (author), van der Walle, P (author)To qualify tools of semiconductor manufacturing, particles unintentionally deposited in these tools are character-ized using blank wafers. With fast optical inspection tools one can quickly localize these particle defects. An ex-ample is TNO's Rapid Nano, which operates in optical darkfield. The next step is defect review for further...journal article 2016