A novel flexible ultrasound neurostimulator featuring a pitch-matched 2D array

Wafer Scale Flexible Interconnect Fabrication for Heterogeneous Integration

System in a package (SIP) allows integrated circuit (ICs) modules or other components from different suppliers and technologies to be integrated into highly functional products. This SIP could realize miniaturized and multifunctional systems enabling emerging technologies like solid-state lightening (SSL), internet of things (IOT), etc. Due to...

Foldable 3D Wafer Level SSL Package Using Flexible Interconnect

Solid State Lighting (SSL) is on track to replace conventional incandescent and fluorescent sources for general lighting. Even though it offers many benefits, the high initial device costs are still a major hindrance for many consumers. Packaging can account for up to half of the total device price, offering high potential for cost reduction. In...

Karakteristieken van de Single Grain Thin Film Transistor op polyimide substraat

Dit onderzoek richt zich op het fabriceren van een passieve sensor op een plastic substraat. Momenteel worden er op het Delft Institute of Microsystems and Nanoelectronics (DIMES) Technology Center nieuwe productietechnieken voor thin-film transistoren (TFT) op polyimide getest waarmee de kosten voor massale productie flink dalen. Deze nieuwe...