Technology Development for MEMS: A Tutorial

Silicon sensors date back to before 1960 with early Hall and piezoresistive devices. These used simple processing that was part of the early integrated circuit (IC) industry. As the IC industry developed, silicon sensors could benefit from the technological advances. As silicon sensors advanced, there came the need for new technologies...

Wafer-scale transfer-free process of multi-layered graphene grown by chemical vapor deposition

Chemical vapour deposition (CVD) has emerged as the dominant technique to combine high quality with large scale production of graphene. The key challenge for CVD graphene remains the transfer of the film from the growth substrate to the target substrate while preserving the quality of the material. Avoiding the transfer process of single or...

Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing

This article shows the fabrication process and packaging of through polymer optical vias (TPOV). The TPOV enables encapsulation and packaging of silicon photonic systems using film assisted molding (FAM) and the creation of micron-sized through polymer optical vias. The optical vias are lithographically defined in thick film photo-resist (∼ 300...

Stretchable Binary Fresnel Lens for Focus Tuning

This paper presents a tuneable binary amplitude Fresnel lens produced by wafer-level microfabrication. The Fresnel lens is fabricated by encapsulating lithographically defined vertically aligned carbon nanotube (CNT) bundles inside a polydimethyl-siloxane (PDMS) layer. The composite lens material combines the excellent optical absorption...