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Hou, F. (author), Wang, W. (author), Lin, Tingyu (author), Cao, Liqiang (author), Zhang, Kouchi (author), Ferreira, Jan Abraham (author)In this paper, a novel fan-out panel-level printed circuit board (PCB) embedded package technology for silicon carbide (SiC) MOSFET power module is presented to address parasitic inductances, heat dissipation, and reliability issues that are inherent with aluminum wires used in conventional packaging scheme. To withstand high temperature...journal article 2019
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Hou, T. (author), Xu, J. (author), Elkhuizen, W.S. (author), Wang, C.C. (author), Jiang, Jiehui (author), Geraedts, Jo M.P. (author), Song, Y. (author)2D coil design limits the use of wireless power transfer (WPT) in many products with freeform outer shapes. In this paper, enabled by 3D printed electronics, we propose a systematic approach to design and fabricate 3D coils for WPT. Based on the circular spiral and rectangular spiral patterns, 3D receiver and transmitter coils can be...journal article 2019
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Hou, F. (author), Wang, Qidong (author), Chen, Min (author), Zhang, Kouchi (author), Ferreira, Jan Abraham (author), Wang, Wenbo (author), Ma, R. (author), Su, Meiying (author), Song, Yang (author)In this article, a novel fan-out panel-level printed circuit board (PCB)-embedded package for phase-leg silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) power module is presented. Electro-thermo-mechanical co-design was conducted, and the maximum package parasitic inductance was found to be about 1.24 nH at 100...journal article 2020