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Multi Physics Simulation of Wafer Bonding with Nano Copper Paste
Warpage deformation analysis of AMB ceramic substrates in power modules
Combined effects of stress and temperature on hydrogen diffusion in non-hydride forming alloys applied in gas turbines
Finite element modeling and analysis of ultrasonic bonding process of thick aluminum wires for power electronic packaging
Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package
Fixation effects of different types of cannulated screws on vertical femoral neck fracture: A finite element analysis and experimental study
Numerical parametric study on ultimate load and ductility of concrete encased equal-leg angle steel composite columns
Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages
An improved stress recovery technique for low-order 3D finite elements
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