An ultrasound powering TX ASIC for brain implants with autonomous on-chip standing-wave peak tracking for RX power (PDL) regulation is presented. With a proposed adiabatic power-sensing scheme, the TX consumes 43μW for power tracking, and the system achieves a settling time of <90ms while using the standing-wave peak-tracking FSM. The TX can achieve PDL improvement of up to 2.7× with a power-tracking accuracy of 82%.

State-of-the-art intracortical neural recording and stimulation systems rely on subdural implants tethered to a cranial implant which itself has a wireless power and data link to the outside world [1] (Fig. 6.2.1). However, this tethered configuration poses challenges such as scarring and potential damage to the surrounding tissue due to strain and micromotions, making this approach unsuitable for chronical implants [2]. Consequently, there is growing interest in wireless connections between cranial and subdural implants. This paper focuses on wireless powering between implants, traversing the dura and cerebrospinal fluid (CSF) tissue layers over distances of 0.5 to 1cm (transdural powering). With modern burr-hole craniotomy, the hole drilled in the skull is 6mm in diameter, limiting the available size for the TX. Moreover, the power dissipation of the TX must be low to keep tissue heating below 1°C [3]. RF and optical modalities suffer from higher attenuation in tissue compared to ultrasound (0.6dB/cm/MHz) [4]. Furthermore, for transdural powering, power losses from reflections at medium interfaces (e.g., skull) are avoided, making ultrasound (US) a prime candidate for efficient in-body wireless power transfer. US is also preferable to inductive powering since US beam steering up to large angles (>45°) is needed to maximize power delivery and compensate for brain micromotions of up to ±4mm [5] and misalignment during surgery. However, prior art US driving systems either use single-phase transducer driving [6, 7], incapable of beam steering, or use class D drivers with low power transfer efficiency (PTE) [8, 9]. A phased array with increased driving efficiency was presented in [10], but it cannot perform beam steering without grating lobes that can be eliminated with miniature transducers with a pitch close to λ/2. To facilitate direct integration between CMOS and the transducer array, the CMOS driving units should also be pitch matched [8, 9].

A near-field galvanic coupled transdural telemetry ASICs for intracortical brain-computer interfaces is presented. The proposed design features a two channels transmitter and three channels receiver (2TX-3RX) topology, which introduces spatial diversity to effectively mitigate misalignments (both lateral and rotational) between the brain and the skull and recovers the path loss by 13 dB when the RX is in the worst-case blind spot. This spatial diversity also allows the presented telemetry to support the spatial division multiplexing required for a high-capacity multi-implant distributed network. It achieves a signal-to-interference ratio of 12 dB, even with the adjacent interference node placed only 8 mm away from the desired link. While consuming only 0.33 mW for each channel, the presented RX achieves a wide bandwidth of 360 MHz and a low input referred noise of 13.21 nV/√ H z. The presented telemetry achieves a 270 Mbps data rate with a BER < 10 −6 and an energy efficiency of 3.4 pJ/b and 3.7 pJ/b, respectively. The core footprint of the TX and RX modules is only 100 and 52 mm 2 , respectively, minimizing the invasiveness of the surgery. The proposed transdural telemetry system has been characterized ex-vivo with a 7-mm thick porcine tissue.

Intra-cortical extracellular neural sensing is being rapidly and widely applied in several clinical research and brain-computer interfaces (BCIs), as the number of sensing channels continues to double every 6 years. By distributing multiple high-density extracellular micro-electrode arrays (MEAs) in vivo across the brain, each with 1000's of sensing channels, neuroscientists have begun to map the correlation of neuronal activity across different brain regions, with single-neuron precision [1]. Since each neural sensing channel typically samples at 20 to 50kS/s with a > 10b ADC, multiple MEAs demand a data transfer rate up to Gb/s [2]. However, these BCIs are severely hindered in many clinical uses due to the lack of a high-data-rate and miniature-wireless-telemetry solution that can be implanted below the scalp, i.e., transcutaneously (Fig. 24.2.1). The area of the wireless telemetry module should be miniaturized to ~3cm² due to neurosurgical implantation constraints. A transmission range up to 10cm is highly desirable, in order to improve the reliability of the wireless link against e.g., antenna misalignment, etc. Finally, the power consumption of the wireless telemetry should be limited to ~10mW to minimize thermal flux from the module's surface area, avoiding excessive tissue heating. Most of the conventional transcutaneous wireless telemetry systems adopt inductive coupling, but the data-rate is limited to a few Mb/s. A near-infrared (NIR) optical transcutaneous TX using a vertical-cavity-surface-emitting laser (VCSEL) [2] demonstrated a data-rate up to 300Mb/s but suffers from a limited transmission range (4mm) and requires a sub-mm precise alignment between the implant TX and a wearable RX. Impulse-radio UWB (IR-UWB) is promising for the targeted requirements [3]–[5].