Jiang Song Zhang

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Conference paper (1)

1 records found

The performance of sintered nanocopper interconnections for high temperature device

Conference paper (2018) - Qipeng Liu , Xianping Chen , Jie Zhu , HuanKun Zhang , Jiang Song Zhang , Jing Guo Zhang , LiGen Wang , Huaiyu Ye , Sau Wee Koh , G.O. Zhang

IGBT device is developed from silicon to wide bandgap semiconductor materials, and its working temperature has reached to 300 °C, so the encapsulation is particularly important. NanoCu paste is investigated under H2 at 300°C. A chip is linked to DBC substrate by nanoCu paste unde ...