Contactless handling systems for substrates hold significant potential in enhancing chip manufacturing yields by allowing the use of thinner and larger substrates, eliminating the risks associated with physical contact. This article introduces a novel contactless force actuator, employing the active air-bearing working principle, designed with a compact structure to effectively actuate substrates. The actuator features a continuous deformable air-bearing surface composed of compliant-based actuation unit cells, ensuring ease of fabrication to meet tight air-bearing tolerances. A modular design with seven unit cells is designed and manufactured to validate the performance. The results confirm that the proposed contactless actuator can be used to levitate and actuate the substrate simultaneously, in which case the maximum actuation force in the x -axis is determined to be 90 mN and a 42.5- μ m fly height in the z -axis is achieved.