HC

Hsing-Wei Chu

Authored

2 records found

While moisture diffusion in microelectronic device and packaging has been studied for decades, the problems involving complex nonlinear moisture diffusion in multi-material assembly have not been fully studied. This paper has developed a general nonlinear diffusion model by adopt ...
This paper presents a comprehensive review and comparison of different theories and models for water vapor pressure under rapid heating in moisture permeable materials, such as polymers or polymer composites. Numerous studies have been conducted, predominately in microelectronics ...