Purpose: The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP) approach. This new packaging approach is based on stacked silicon submount technology. As demonstrators, a smart lighting module and a sensor systems were successfully developed by using the fabrication and assembly process described in this paper. Design/methodology/approach: The stacked module consists of multiple layers of silicon submounts which can be designed and fabricated in parallel. The 3D stacking design offers higher silicon efficiency and miniaturized package form factor. This platform consists of silicon submount design and fabrication, module packaging, system assembling and testing and analyzing. Findings: In this paper, a smart light emitting diode system and sensor system will be described based on stacked silicon submount and 3D SiP technology. The integrated smart lighting module meets the optical requirements of general lighting applications. The developed SiP design is also implemented into the miniaturization of particular matter sensors and gas sensor detection system. Originality/value: SiP has great potential of integrating multiple components into a single compact package, which has potential implementation in intelligent applications.

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As more and more proofs show that fine particles (diameter of 2.5μm and below) pose more risk on human health than coarse particles, an increasing need for monitoring fine particles has emerged. A miniaturized sensor designed for measuring fine particle concentration is presented in this paper. The proposed sensor possesses a compact size of only 15 mm × 10mm × 1mm. A virtual impactor has been integrated as a particle size selector and the design is optimized by simulation-assisted analysis. The sensor is realized by silicon microfabrication and wafer-level packaging. Testing results show that a high measurement accuracy of 2.55 μg/m3 has been achieved.@en

With the increasing public awareness ofthe impact of particulate matter (PM) on human health, real-time monitoring of PM exposure level has attracted more interest than ever before. While a great deal of effort has been put into the miniaturization of PM sensors, a wider range of applications is still hindered by big form factor and high cost. In this paper a novel design of PM sensor based on silicon microfabrication is presented. Silicon microfabrication and assembly process enables relatively small form factor and low cost. The operation principle of the sensor is light scattering method, an indirect way of measuring PM concentration. Silicon-based microfluidics serve as air flow channel and provide sealed sensing chamber for collecting scattered light by aerosol particles. The main chip components are integrated in the form of bare dies, reducing the size of the whole system. The main body of the sensor possesses small size of 15 × 10 × 1 mm3, enabling easy integration into portable and wearable electronics. The light source in the sensor consumes less than 5 mW of power and the total power consumption is still low enough to make it suitable for battery-powered devices. In-lab and field testing and calibration results have shown that the sensor can achieve an accuracy of less than 10 g/m3 and prompt response (within s) to particle concentration changes. Detailed design, fabrication as well as testing results will be explained in this paper.@en