MD
M. Dong
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3 records found
1
Journal article
(2017)
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Mingzhi Dong, Elina Iervolino, Fabio Santagata, Guoyi Zhang, Guoqiang Zhang
As more and more proofs show that fine particles (diameter of 2.5μm and below) pose more risk on human health than coarse particles, an increasing need for monitoring fine particles has emerged. A miniaturized sensor designed for measuring fine particle concentration is presented in this paper. The proposed sensor possesses a compact size of only 15 mm × 10mm × 1mm. A virtual impactor has been integrated as a particle size selector and the design is optimized by simulation-assisted analysis. The sensor is realized by silicon microfabrication and wafer-level packaging. Testing results show that a high measurement accuracy of 2.55 μg/m3 has been achieved.
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As more and more proofs show that fine particles (diameter of 2.5μm and below) pose more risk on human health than coarse particles, an increasing need for monitoring fine particles has emerged. A miniaturized sensor designed for measuring fine particle concentration is presented in this paper. The proposed sensor possesses a compact size of only 15 mm × 10mm × 1mm. A virtual impactor has been integrated as a particle size selector and the design is optimized by simulation-assisted analysis. The sensor is realized by silicon microfabrication and wafer-level packaging. Testing results show that a high measurement accuracy of 2.55 μg/m3 has been achieved.
As we enter era of “intelligence”, an increasing number of smart devices are being equipped around us. Such devices reflect the emerging need in microelectronics industry: increased functionality and miniaturization. As Moore’s law gradually meets its bottleneck, the concept of “More-than-Moore” (MtM) is proposed to address this issue by migrating board level system assembly to package level system integration. System in package (SiP) technology emerges as a promising solution for increasing the level of integration. Together with other novel packaging technologies, such as wafer level packaging (WLP), SiP shows great potential for providing intensely integrated functional system with miniaturized form factor. This thesis aims to develop novel SiP design and implement it into intelligent applications such as solid state lighting (SSL) and particulate matter (PM) sensor.
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As we enter era of “intelligence”, an increasing number of smart devices are being equipped around us. Such devices reflect the emerging need in microelectronics industry: increased functionality and miniaturization. As Moore’s law gradually meets its bottleneck, the concept of “More-than-Moore” (MtM) is proposed to address this issue by migrating board level system assembly to package level system integration. System in package (SiP) technology emerges as a promising solution for increasing the level of integration. Together with other novel packaging technologies, such as wafer level packaging (WLP), SiP shows great potential for providing intensely integrated functional system with miniaturized form factor. This thesis aims to develop novel SiP design and implement it into intelligent applications such as solid state lighting (SSL) and particulate matter (PM) sensor.
With the increasing public awareness ofthe impact of particulate matter (PM) on human health, real-time monitoring of PM exposure level has attracted more interest than ever before. While a great deal of effort has been put into the miniaturization of PM sensors, a wider range of applications is still hindered by big form factor and high cost. In this paper a novel design of PM sensor based on silicon microfabrication is presented. Silicon microfabrication and assembly process enables relatively small form factor and low cost. The operation principle of the sensor is light scattering method, an indirect way of measuring PM
concentration. Silicon-based microfluidics serve as air flow channel and provide sealed sensing chamber for collecting scattered light by aerosol particles. The main chip components are integrated in the form of bare dies, reducing the size of the whole system. The main body of the sensor possesses small size of 15 × 10 × 1 mm3, enabling easy integration into portable and wearable electronics. The light source in the sensor consumes less than 5 mW of power and the total power consumption is still low enough to make it suitable for battery-powered devices. In-lab and field testing and calibration results have shown that the sensor can achieve an accuracy of less than 10 g/m3 and prompt response (within s) to particle concentration changes. Detailed design, fabrication as well as testing results will be explained in this paper.
...
With the increasing public awareness ofthe impact of particulate matter (PM) on human health, real-time monitoring of PM exposure level has attracted more interest than ever before. While a great deal of effort has been put into the miniaturization of PM sensors, a wider range of applications is still hindered by big form factor and high cost. In this paper a novel design of PM sensor based on silicon microfabrication is presented. Silicon microfabrication and assembly process enables relatively small form factor and low cost. The operation principle of the sensor is light scattering method, an indirect way of measuring PM
concentration. Silicon-based microfluidics serve as air flow channel and provide sealed sensing chamber for collecting scattered light by aerosol particles. The main chip components are integrated in the form of bare dies, reducing the size of the whole system. The main body of the sensor possesses small size of 15 × 10 × 1 mm3, enabling easy integration into portable and wearable electronics. The light source in the sensor consumes less than 5 mW of power and the total power consumption is still low enough to make it suitable for battery-powered devices. In-lab and field testing and calibration results have shown that the sensor can achieve an accuracy of less than 10 g/m3 and prompt response (within s) to particle concentration changes. Detailed design, fabrication as well as testing results will be explained in this paper.