System in package for intelligent lighting and sensing applications

Doctoral thesis (2016)

Authors

M. Dong Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Copyright: © 2016 M. Dong
DOI
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https://doi.org/10.4233/uuid:b9a684b9-b75f-4b59-b623-37c977ae8b85
System in package Intelligent lighting Particulate matter sensor
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Published Date

2016

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

As we enter era of “intelligence”, an increasing number of smart devices are being equipped around us. Such devices reflect the emerging need in microelectronics industry: increased functionality and miniaturization. As Moore’s law gradually meets its bottleneck, the concept of “More-than-Moore” (MtM) is proposed to address this issue by migrating board level system assembly to package level system integration. System in package (SiP) technology emerges as a promising solution for increasing the level of integration. Together with other novel packaging technologies, such as wafer level packaging (WLP), SiP shows great potential for providing intensely integrated functional system with miniaturized form factor. This thesis aims to develop novel SiP design and implement it into intelligent applications such as solid state lighting (SSL) and particulate matter (PM) sensor.