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Y Lamy

Book chapter (1)

Conference paper (1)

Journal article (1)

3 records found

1

Oxidized ALD-deposited titanium nitride films as a low-temperature alternative for enhancing the wettability of through-silicon vias

Conference paper (2009) - M Saadaoui (author) , HW van Zeijl (author) , Lina Sarro (author) , TMH Pham (author) , HC MKnoops (author) , Wilhelmus M.M. Kessels (author) , MCM van de Sanden (author) , F Roozeboom (author) , Y Lamy (author) , KB Jinesh (author) , W. Besling (author)

Continuous deep reactive ion etching of tapered via holes for three-dimensional integration

Journal article (2008) - R Li (author) , Y Lamy (author) , WFA Besling (author) , F Roozeboom (author) , PM Sarro (author)

Deep reactive ion etching in through-silicon via technology

Book chapter (2007) - F Roozeboom (author) , MA Blauw (author) , Y Lamy (author) , E van Grunsven (author) , W Dekkers (author) , JF Verhoeven (author) , F van den Heuvel (author) , E.W.J.M. van der Drift (author) , WMM Kessels (author) , MCM van de Sanden (author)