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YL
Y Lamy
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3 records found
Oxidized ALD-deposited titanium nitride films as a low-temperature alternative for enhancing the wettability of through-silicon vias
Conference paper -
M Saadaoui
,
H.W. van Zeijl
,
Pasqualina M Sarro
,
HTM Pham
,
HC MKnoops
,
WMM Kessels
,
MCM van de Sanden
,
F Roozeboom
,
Y Lamy
,
KB Jinesh
,
W. Besling
Continuous deep reactive ion etching of tapered via holes for three-dimensional integration
Journal article -
R Li
,
Y Lamy
,
WFA Besling
,
F Roozeboom
,
Pasqualina M Sarro
Deep reactive ion etching in through-silicon via technology
Book chapter -
F Roozeboom
,
MA Blauw
,
Y Lamy
,
E van Grunsven
,
W Dekkers
,
JF Verhoeven
,
F van den Heuvel
,
E.W.J.M. van der Drift
,
WMM Kessels
,
MCM van de Sanden