This thesis investigates the application of force control techniques to enhance industrial wire bonding processes. It entails the design of a simulation model for the Z-axis interaction between bondhead and environment, followed by the implementation of a Parallel Force Control architecture in Simulink. The study evaluates different force and position control methods, selecting those suitable for single-degree-of-freedom wire bonding. Simulation model validation through system identification and inclusion of an impact transition phase ensures accurate bondhead-substrate interaction representation. Results show that the implemented controllers effectively eliminate force overshoot, mitigating substrate damage risks, even with suboptimal controllers. This thesis contributes to the understanding of force control's potential in industrial wire bonding processes. The developed simulation model serves as a platform for evaluating controller effectiveness, optimizing process outcomes, and aiding future research and experimentation in this domain.