Insights into the high-sulphur aging of sintered silver nanoparticles
An experimental and ReaxFF study
D. Hu (TU Delft - Electronic Components, Technology and Materials)
Tijian Gu (Hohai University)
Z. Cui (TU Delft - Electronic Components, Technology and Materials)
S. Vollebregt (TU Delft - Electronic Components, Technology and Materials)
Xuejun Fan (Lamar University)
Kouchi Zhang (TU Delft - Electronic Components, Technology and Materials)
J. Fan (Fudan University, TU Delft - Electronic Components, Technology and Materials)
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Abstract
In high power electronics packaging, sintered silver nanoparticle joints suffer from thermal-humidity- electrical-chemical joint driven corrosion in extreme environments. In this paper, we conducted aging tests on sintered silver nanoparticles under high-temperature, high-humidity, and high-sulphur conditions. The results show that: (1) the sample under the dry high-sulphur conditions at a high temperature exhibited the highest degree of sulphidation; (2) Reactive force field (ReaxFF) molecular dynamics (MD) simulations of sintered silver nanoparticle sulphidation revealed the sulphidation layer was formed by silver atoms upward migration. This work paves the way for further investigation on sintered silver nanoparticles corrosion considering multi-physics coupling effects.