Insights into the high-sulphur aging of sintered silver nanoparticles

An experimental and ReaxFF study

Journal article (2021)

Authors

D. Hu Electronic Components, Technology and Materials - EEMCS
Tijian Gu Hohai University
Z. Cui Electronic Components, Technology and Materials - EEMCS
S. Vollebregt Electronic Components, Technology and Materials - EEMCS
Xuejun Fan Lamar University
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
J. Fan Electronic Components, Technology and Materials - EEMCS , Fudan University
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Copyright: © 2021 D. Hu, Tijian Gu, Z. Cui, S. Vollebregt, Xuejun Fan, Kouchi Zhang, J. Fan
DOI
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https://doi.org/10.1016/j.corsci.2021.109846
Silver B. SEM B. Modelling studies C. Interface C. Oxidation C. Sulphidation
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Published Date

2021

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

In high power electronics packaging, sintered silver nanoparticle joints suffer from thermal-humidity- electrical-chemical joint driven corrosion in extreme environments. In this paper, we conducted aging tests on sintered silver nanoparticles under high-temperature, high-humidity, and high-sulphur conditions. The results show that: (1) the sample under the dry high-sulphur conditions at a high temperature exhibited the highest degree of sulphidation; (2) Reactive force field (ReaxFF) molecular dynamics (MD) simulations of sintered silver nanoparticle sulphidation revealed the sulphidation layer was formed by silver atoms upward migration. This work paves the way for further investigation on sintered silver nanoparticles corrosion considering multi-physics coupling effects.