Thermal and mechanical effects of voids within flip chip soldering in LED packages
Journal Article
(2014)
Author(s)
Y. Liu (TU Delft - Electronic Components, Technology and Materials)
SYY Leung (External organisation)
J Zhao (External organisation)
CKY Wong (TU Delft - Electronic Components, Technology and Materials)
CA Yuan (TU Delft - Electronic Components, Technology and Materials)
Guo Qi Z Zhang (TU Delft - Electronic Components, Technology and Materials)
F Sun (External organisation)
L Luo (External organisation)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1016/j.microrel.2014.07.034
To reference this document use:
https://resolver.tudelft.nl/uuid:0261656a-47be-463c-9995-6b83b432ab35
More Info
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Publication Year
2014
Language
English
Research Group
Electronic Components, Technology and Materials
Issue number
9-10
Volume number
54
Pages (from-to)
2028-2033
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