Thermal and mechanical effects of voids within flip chip soldering in LED packages

Y Liu (TU Delft - Electronic Components, Technology and Materials)

SYY Leung (External organisation)

J Zhao (External organisation)

CKY Wong (TU Delft - Electronic Components, Technology and Materials)

CA Yuan (TU Delft - Electronic Components, Technology and Materials)

GQ Zhang (TU Delft - Electronic Components, Technology and Materials)

F Sun (External organisation)

L Luo (External organisation)