Thermal and mechanical effects of voids within flip chip soldering in LED packages

Journal article (2014)

Authors

Y. Liu Electronic Components, Technology and Materials - EEMCS
SYY Leung External organisation
J Zhao External organisation
K.Y. Wong Electronic Components, Technology and Materials - EEMCS
C.A. Yuan Electronic Components, Technology and Materials - EEMCS
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
F Sun External organisation
L Luo External organisation
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2014

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials