Thermal and mechanical effects of voids within flip chip soldering in LED packages

Journal Article (2014)

Author(s)

Y Liu (TU Delft - Electrical Engineering, Mathematics and Computer Science)

SYY Leung (External organisation)

J Zhao (External organisation)

CKY Wong (TU Delft - Electrical Engineering, Mathematics and Computer Science)

CA Yuan (TU Delft - Electrical Engineering, Mathematics and Computer Science)

GQ Zhang (TU Delft - Electrical Engineering, Mathematics and Computer Science)

F Sun (External organisation)

L Luo (External organisation)

Research Group

Electronic Components, Technology and Materials

DOI related publication

https://doi.org/10.1016/j.microrel.2014.07.034 Final published version

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Publication Year

2014

Language

English

Research Group

Electronic Components, Technology and Materials

Journal title

Microelectronics Reliability

Issue number

9-10

Volume number

54

Pages (from-to)

2028-2033

Page Views

265