CY
C.A. Yuan
Authored
20 records found
Advances in delamination modeling of metal/polymer systems
Atomistic aspects
Adhesion and delamination have been pervasive problems hampering the performance and reliability of micro-and nano-electronic devices. In order to understand, predict, and ultimately prevent interface failure in electronic devices, development of accurate, robust, and efficient d
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Gas sensors fabricated with nanowires as the detecting elements are powerful due to their many improved characteristics such as high surface-to-volume ratios, ultrasensitivity, higher selectivity, low power consumption, and fast response. This paper gives an overview on the recen
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Lighting is an advancing phenomenon both on the technology and on the market level due to the rapid development of the solid state lighting technology. The efforts in improving the efficacy of high brightness LED's (HB-LED) have concentrated on the packaging architecture. Packagi
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Lighting is an advancing phenomenon both on the technology and on the market level due to the rapid development of the solid state lighting technology. The efforts in improving the efficacy of high brightness LED's (HB-LED) have concentrated on the packaging architecture. Packagi
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Lighting is an advancing phenomenon both on the technology and on the market level due to the rapid development of the solid state lighting technology. The efforts in improving the efficacy of high brightness LED's (HB-LED) have concentrated on the packaging architecture. Packagi
...
Lighting is an advancing phenomenon both on the technology and on the market level due to the rapid development of the solid state lighting technology. The efforts in improving the efficacy of high brightness LED's (HB-LED) have concentrated on the packaging architecture. Packagi
...
Lighting is an advancing phenomenon both on the technology and on the market level due to the rapid development of the solid state lighting technology. The efforts in improving the efficacy of high brightness LED's (HB-LED) have concentrated on the packaging architecture. Packagi
...
Lighting is an advancing phenomenon both on the technology and on the market level due to the rapid development of the solid state lighting technology. The efforts in improving the efficacy of high brightness LED's (HB-LED) have concentrated on the packaging architecture. Packagi
...
Molecular dynamics (MD) and molecular mechanical (MM) analysis are carried out to provide reliable and accurate model for emeraldine base polyaniline. This study validate the forcefields and model with the physical and mechanical properties of the polyaniline. The temperature eff
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Molecular dynamics (MD) and molecular mechanical (MM) analysis are carried out to provide reliable and accurate model for emeraldine base polyaniline. This study validate the forcefields and model with the physical and mechanical properties of the polyaniline. The temperature eff
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We report a molecular modeling study to evaluate and select conducting polymers (CPs) for use as the sensing layer for carbon dioxide (CO2) sensor. The interactions between gases and sensing materials and the adsorptions of small gas molecules on polymer sensing films are describ
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In this paper, the Copper wirebonding technology is investigated. From a numerical point of view, the wirebonding process is modelled. Experiments on specially designed bondpads are performed in order to verify the models. As such, this leads to a thorough understanding of the wi
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In this paper, the Copper wirebonding technology is investigated. From a numerical point of view, the wirebonding process is modelled. Experiments on specially designed bondpads are performed in order to verify the models. As such, this leads to a thorough understanding of the wi
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The mechanical stiffness of the silica nano-structures, including the crystalline silicon and amorphous silica, is studied using the molecular dynamics (MD) method. The MD simulation procedure is based on the linear-elastic theory, and the stiffness parameter can be acquired by t
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The mechanical stiffness of the silica nano-structures, including the crystalline silicon and amorphous silica, is studied using the molecular dynamics (MD) method. The MD simulation procedure is based on the linear-elastic theory, and the stiffness parameter can be acquired by t
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The mechanical stiffness of the silica nano-structures, including the crystalline silicon and amorphous silica, is studied using the molecular dynamics (MD) method. The MD simulation procedure is based on the linear-elastic theory, and the stiffness parameter can be acquired by t
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The mechanical stiffness of the silica nano-structures, including the crystalline silicon and amorphous silica, is studied using the molecular dynamics (MD) method. The MD simulation procedure is based on the linear-elastic theory, and the stiffness parameter can be acquired by t
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The mechanical stiffness of the silica nano-structures, including the crystalline silicon and amorphous silica, is studied using the molecular dynamics (MD) method. The MD simulation procedure is based on the linear-elastic theory, and the stiffness parameter can be acquired by t
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The mechanical stiffness of the silica nano-structures, including the crystalline silicon and amorphous silica, is studied using the molecular dynamics (MD) method. The MD simulation procedure is based on the linear-elastic theory, and the stiffness parameter can be acquired by t
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This paper presents our effort to predict reliability problems for MEMS packages. MEMS devices are vulnerable to the external loads subjected to it. As such, MEMS devices need to be protected. Protections can be generated by capping the device: a piece of silicon is placed on top
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