Thermo-mechanical Model Optimization of HB-LED Packaging

Journal article (2011)

Authors

C.A. Yuan TNO Science and Industry, Electronic Components, Technology and Materials - EEMCS
Müge Erinc TNO Science and Industry
Sander Gielen TNO Science and Industry
Adri van der Waal TNO Science and Industry
W.D. van Driel Philips Lighting Research, Electronic Components, Technology and Materials - EEMCS
Kouchi Zhang Philips Lighting Research, Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2011

Language

English

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

Lighting is an advancing phenomenon both on the technology and on the market level due to the rapid development of the solid state lighting technology. The efforts in improving the efficacy of high brightness LED's (HB-LED) have concentrated on the packaging architecture. Packaging plays a significant role in reliability; not only on mechanical protection but also on thermal management. An efficient numerical model using the finite element technique to evaluate thermal and mechanical performance of LED packaging is presented in this article. A commercial HB-LED package is used as a benchmark example and a strategy relying on the obtained thermo-mechanical response to reduce the mesh size and density is proposed. Next, two new HB-LED concepts are simulated based on the proposed finite element modeling strategy.